參數(shù)資料
型號: MAX2720EUP
廠商: MAXIM INTEGRATED PRODUCTS INC
元件分類: 衰減器
英文描述: 1.7GHz to 2.5GHz, Direct I/Q Modulator with VGA and PA Driver
中文描述: 1700 MHz - 2100 MHz RF/MICROWAVE UP CONVERTER, -6 dBm OUTPUT POWER-MAX
封裝: TSSOP-20
文件頁數(shù): 19/24頁
文件大?。?/td> 319K
代理商: MAX2720EUP
M
1.7GHz to 2.5GHz, Direct I/Q Modulator with
VGA and PA Driver
______________________________________________________________________________________
19
DC-blocking capacitor that can be part of the matching
network. The DROUT open-collector output port
requires an external matching network and a pull-up
inductor to V
CC
for proper biasing. The pull-up inductor
is incorporated as part of the matching network. See
the MAX2720 and MAX2721
Typical Application Circuit
for recommended component values. Refer to Table 3
for matching to other frequencies.
If the additional gain of the PA driver is not required,
disable the PA driver to reduce current consumption.
To disable the PA driver, short pin 20 (DRIN) to ground
and leave pin 2 unconnected.
Shutdown
Apply a logic-level high to the
SHDN
pin to enable the
MAX2720/MAX2721. Apply a logic-level low voltage to
disable the device and reduce supply current to less
than 0.1μA.
Applications Information
Layout Considerations
A properly designed PC board is an essential part of
any RF circuit. A ground plane is essential. Keep RF
signal lines as short as possible to reduce losses, radi-
ation, and inductance. Use separate, low-inductance
vias to the ground plane for each pin. For best perfor-
mance, solder the exposed pad on the bottom of the
device package evenly to the board ground plane.
Remove the ground plane under the external VCO and
lowpass filters to reduce the effects of parasitic capaci-
tance. In direct I/Q modulator applications, radiated
power from the PA can couple into the VCO tank. To
reduce PA injection-pulling, the external VCO should be
housed in a separate shielded compartment if possible.
Power-Supply, Logic, and PC
Input Bypassing
Proper voltage supply bypassing is essential for high-fre-
quency circuit stability. With the exception of pin 6,
bypass all V
CC
pins with a 470pF capacitor as close to
the V
CC
pins as possible. The decoupling capacitor for
pin 6 also serves as part of an on-chip matching network,
so it should be chosen to resonate out series inductance
on the board. Some empirical adjustment may yield
increased output power. See the MAX2720/MAX2721
Typical Application Circuit
for suggested values.
Bypass the
ENX2
,
SHDN,
and PC inputs with a 1000pF
capacitor to ground to minimize noise injected into the
device. Use a series resistor (10k
typ) to further
reduce coupling of high-frequency signals into the
device.
Voltage supply layout is also critical to achieve optimum
performance. The IC has several RF processing stages
that use the various V
CC
pins, and while they have
on-chip decoupling, off-chip interaction between them
may degrade gain, linearity, carrier suppression, and
output power control range. The supplies associated
with pins 2, 6, 15 (MAX2721 only), and 17 lie directly in
the RF signal path. Pins 4, 12, and 15 carry LO signal
currents, so it is important to keep them from interacting
with the RF signal path to prevent poor carrier suppres-
sion. The VGA generates discarded signal currents on
pin 4, which also need to be kept away from the signal
path supplies. Because there is a great deal of gain
following from the first RF stage, it is also important to
prevent coupling from pins 2, 4, 15, and 17 to pin 6;
excessive coupling may degrade stability.
2100 to 2500
1050 to 1250
1700 to 2100
MAX2721
850 to 1050
Low
High
MAX2720
LO INPUT FREQUENCY RANGE (MHz)
ENX2
LOGIC LEVEL
Table 2. LO Input Frequency Range
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