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Detailed Description
The MAX2648 low-noise amplifier offers high gain, high
linearity, and low-noise performance from 5GHz to
6GHz. This LNA also functions as a PA predriver or an
LO buffer. The device has been fully characterized and
tested in the 5.2GHz and 5.8GHz bands.
Applications Information
Optimal gain and noise figure performance requires
input and output matching circuits tuned for the band
of interest. All electrical specifications and typical oper-
ating characteristics are measured on the MAX2648
evaluation kit (EV kit), which is tuned for operation in
the 5.2GHz band. Referencing the application circuit,
PC board layout, and components specified in the
MAX2648 EV kit data sheet will reduce evaluation and
design time for 5.2GHz ISM-band system designs. For
applications in other bands, refer to the MAX2648 [S]-
parameters (Table 1), noise parameters (Table 2), and
comments below to aid design.
Input Matching
The input stage is internally biased, so no external bias
circuitry is required at RFIN. Be sure to AC-couple to
the input.
Since the noise figure of the LNA design is severely
degraded by low-Q matching components, always
design with high-Q wire-wound inductors and low-loss
capacitors. Remember that package parasitics must be
taken into consideration; always use components with
self-resonant frequencies higher than the intended fre-
quency of operation.
Output Matching
The output of the MAX2648 is an open-collector transis-
tor; the DC bias and RF matching network are off-chip
as illustrated in the
Typical Application Circuit
. Bias the
output stage with V
CC
through an RF choke, leaving as
little pad exposed as possible
—
any exposed pad here
will act like a small tuning stub and contribute a small,
low-Q, shunt capacitor to the matching network.
If area allows, a better way to supply a bias for narrow-
band operation is to design in a quarter-wave transmis-
sion line. The far side of this high-Z
0
transmission line is
AC-shorted to ground with a radial stub; low-frequency
decoupling is handled by a 1000pF shunt capacitor to
ground nearby. Bias this point through an RF choke,
and decouple the supply with a few μF at the V
CC
con-
nection.
Power-Supply Bypassing
Proper power-supply bypassing is essential for high-
frequency circuit stability. Place a small value capacitor
as close to the IC as possible to decouple high-fre-
quency noise. Place a larger value capacitor near the
supply to decouple low-frequency noise. Whenever
possible, place the ground-connected side of bypass
capacitors within a few millimeters of the IC
’
s ground
connections.
Layout Considerations
A properly designed PC board is an essential part of
any RF/microwave circuit. Keep RF signal lines as short
as possible to reduce losses, EMI, and stray induc-
tance. Use multiple separate low-inductance-plated
vias to the ground plane for each ground bump.
The chip-scale package (UCSP) has a bump pitch of
0.5mm (19.7mil) and a bump diameter of 0.3mm
(12mil). Therefore, lay out the solder pad spacing on
0.5mm (19.7mil) centers, and use a pad size of
0.25mm (10mil) and a solder mask opening of 0.33mm
(13mil). Round or square pads are permissible. Refer to
the Maxim application note,
Wafer Level Ultra-Chip-
Scale Packaging
, for additional detailed information on
UCSP layout and handling.
Chip Information
TRANSISTOR COUNT: 85
M
5GHz to 6GHz Low-Noise Amplifier
in 6-Pin UCSP
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5