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參數(shù)資料
| 型號： | MAX2386EBP-T |
| 廠商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分類： | 無繩電話/電話 |
| 英文描述： | CDMA + GPS LNA/Mixers |
| 中文描述： | TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PBGA20 |
| 封裝： | 2.10 X 2.70 MM, UCSP-20 |
| 文件頁數(shù)： | 11/18頁 |
| 文件大?。?/td> | 216K |
| 代理商： | MAX2386EBP-T |
Layout
For the MAX2385/MAX2386, keep RF signal lines as
short as possible to minimize losses and radiation.
Always use controlled-impedance lines on all high-fre-
quency inputs and outputs and use low-inductance
connections to ground on all GND pins. At the mixer
outputs, keep the differential lines together and of the
same length to ensure signal balance.
For the best gain and noise performance, use high-Q
(greater than 40) components for the LNA input match-
ing circuit.
For the power supplies, a star topology works well to
isolate different sections of the device. Each V
CC
node
has its own path to a central V
CC
; place decoupling
capacitors that provide low impedance at the RF fre-
quency of interest close to all V
CC
connections. The
central V
CC
should have a large decoupling capacitor
as well. (Use the MAX2385/MAX2386 EV kit as an
example.)
UCSP Reliability
The UCSP represents a unique package that greatly
reduces board space compared to other packages.
UCSP reliability is integrally linked to the user
’
s assem-
bly methods, circuit board material, and usage environ-
ment. Operating Life and Moisture Resistance remain
uncompromised as they are primarily determined by
the wafer-fabrication process. Mechanical stress per-
formance is a greater consideration for a UCSP. UCSP
solder joint contact integrity must be considered since
the package is attached through direct solder contact
to the user
’
s PC board. Testing done to characterize
the UCSP reliability performance shows that it is capa-
ble of performing reliably through environmental stress-
es. Results of environmental stress tests and additional
usage data and recommendations are detailed in the
UCSP application note, which can be found on Maxim
’
s
website, www.maxim-ic.com.
Chip Information
TRANSISTOR COUNT: 882
M
CDMA + GPS LNA/Mixers
______________________________________________________________________________________
11
Figure 3. Variable Bias Current Application Circuit with Shunt
Resistor and Transistor (Using 3 DSP I/O Ports)
G1
RBIAS
R
BIAS
R
SHUNT
MODE
G2
MAX2385
MAX2386
DSP
Figure 2. Variable Bias Current Application Circuit with Shunt
Resistor (Using 4 DSP I/O Ports)
R
BIAS
R
SHUNT
G1
RBIAS
MODE
G2
MAX2385
MAX2386
DSP
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MAX2394 | MAX2394/MAX2395 Evaluation Kits |
| MAX2395 | MAX2394/MAX2395 Evaluation Kits |
| MAX2396 | Evaluation Kit |
| MAX2402EVKIT-SO | Evaluation Kit |
| MAX2402 | 800MHz to 1000MHz Transmitter(800MHz~1000MHz擴頻發(fā)送器) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX2386EVKIT | 功能描述:射頻開發(fā)工具 RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| MAX2387EGC | 功能描述:射頻混合器 RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| MAX2387EGC+ | 功能描述:射頻混合器 RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| MAX2387EGC-T | 功能描述:射頻混合器 RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| MAX2387ETC | 功能描述:射頻混合器 RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
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