參數(shù)資料
型號(hào): MAX1931
廠商: Maxim Integrated Products, Inc.
英文描述: Current-Limited Switch for Single USB Port
中文描述: 限流開關(guān),支持單USB口
文件頁(yè)數(shù): 7/8頁(yè)
文件大?。?/td> 214K
代理商: MAX1931
M
Current-Limited Switch for Single USB Port
_______________________________________________________________________________________
7
spurious
FAULT
output. Load-transient faults less than
10ms (typ) do not cause a
FAULT
output assertion.
Only current-limit faults are blanked. Die overtempera-
ture faults and input voltage droops below the UVLO
threshold cause an immediate fault output.
Applications Information
Input Capacitor
To limit the input voltage drop during momentary output
short-circuit conditions, connect a capacitor from IN to
GND. A 1μF ceramic capacitor is adequate for most
applications; however, higher capacitor values further
reduce the voltage drop at the input (see Figure 2).
Output Capacitor
Connect a 0.1μF capacitor from OUT to GND. This cap-
acitor helps prevent inductive parasitics from pulling
OUT negative during turn-off.
Layout and Thermal Dissipation
To optimize the switch-response time to output short-
circuit conditions, it is very important to keep all traces
as short as possible to reduce the effect of undesirable
parasitic inductance. Place input and output capacitors
as close to the device as possible (no more than 5mm).
All IN and all OUT pins must be connected with short
traces to the power bus. Wide power bus planes pro-
vide superior heat dissipation through the switch IN and
OUT pins. Figure 3 shows suggested pin connections
for a single-layer board.
Under normal operating conditions, the package can
dissipate and channel heat away. Calculate the maxi-
mum power dissipation as follows:
P = (I
LIMIT
)
2
R
ON
where I
LIMIT
is the preset current limit (1.1A max) and
R
ON
is the on-resistance of the switch (150m
max).
When the output is short-circuited, foldback-current-lim-
iting activates and the voltage drop across the switch
equals the input supply. The power dissipated across
the switch increases, as does the die temperature. If the
fault condition is not removed, the thermal-overload pro-
tection circuitry activates (see the
Thermal Shutdown
section). Wide power-bus planes connected to IN and
OUT and a ground plane in contact with the device
help dissipate additional heat.
1
2
3
4
5
10
9
8
7
6
OUT
IN
OUT
FAULT
OUT
IN
OUT
IN
MAX1931
GND
ON
Figure 3. IN and OUT Cross Connections for a Single-Layer
Board
Figure 2. Typical Application Circuit
Chip Information
TRANSISTOR COUNT: 715
MAX1931
IN
OUTPUT
OUT
INPUT
2.7V TO 5.5V
FAULT
ON
ON
OFF
100k
1
μ
F
0.1
μ
F*
*USB SPECIFICATIONS REQUIRE A LARGER CAPACITOR
GND
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