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參數(shù)資料
| 型號： | MAX14841EASA+T |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 8/15頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC TXRX RS485 40MBPS 8SOIC |
| 產(chǎn)品培訓模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標準包裝： | 2,500 |
| 類型： | 收發(fā)器 |
| 驅(qū)動器/接收器數(shù)： | 1/1 |
| 規(guī)程： | RS485 |
| 電源電壓： | 3 V ~ 3.6 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應商設備封裝： | 8-SOIC |
| 包裝： | 帶卷 (TR) |
2
Maxim Integrated
40Mbps, +3.3V, RS-485 Half-Duplex
Transceivers
MAX14840E/MAX14841E
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
(Voltages referenced to GND.)
VCC ..................................................................... -0.3V to +6.0V
RE, RO .................................................. -0.3V to +(VCC + 0.3V)
DE, DI .................................................................. -0.3V to +6.0V
A, B.................................................................... -8.0V to +13.0V
Short-Circuit Duration (RO, A, B) to GND ............... Continuous
Continuous Power Dissipation (TA = +70NC)
8-Pin SO (derate 7.6mW/NC above +70NC) ............... 606mW
8-Pin TDFN (derate 24.4mW/NC above +70NC) ....... 1951mW
Junction-to-Case Thermal Resistance (BJC) (Note 1)
8-Pin SO.......................................................................38NC/W
8-Pin TDFN ....................................................................8NC/W
Junction-to-Ambient Thermal Resistance (BJA) (Note 1)
8-Pin SO ....................................................................132NC/W
8-Pin TDFN ..................................................................41NC/W
Operating Temperature Range ...................... -40NC to +125NC
Junction Temperature .................................................. +150NC
Storage Temperature Range ......................... -65NC to +150NC
Lead Temperature (soldering, 10s) ...............................+300NC
Soldering Temperature (reflow) ......................................+260NC
DC ELECTRICAL CHARACTERISTICS
(VCC = +3.0V to +3.6V, TA = -40NC to +125NC, unless otherwise noted. Typical values are at VCC = +3.3V and TA = +25NC.) (Notes 2, 3)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
POWER SUPPLY
Supply Voltage
VCC
3.0
3.6
V
Supply Current
ICC
DE = RE = VCC, or
DE = RE = GND, or
DE = VCC, RE = GND,
DI = VCC or GND, no load
1.5
4
mA
Shutdown Supply Current
ISH
DE = GND and RE = VCC
10
F
A
DRIVER
Differential Driver Output
VOD
RL = 54I, Figure 1
1.5
V
Change in Magnitude of
Differential Output Voltage
D
VOD
RL = 54I, Figure 1 (Note 4)
-0.2
0
+0.2
V
Driver Common-Mode Output
Voltage
VOC
RL = 54I, Figure 1
VCC/2
3
V
Change in Common-Mode
Voltage
D
VOC
RL = 54I, Figure 1 (Note 4)
-0.2
0.2
V
Single-Ended Driver Output High
VOH
A/B output, IOUT = -20mA
2.2
V
Single-Ended Driver Output Low
VOL
A/B output, IOUT = 20mA
0.8
V
Driver Short-Circuit Output
Current
|IOSD|
0V P VOUT P +12V, output low
250
mA
-7V P VOUT P VCC, output high
250
RECEIVER
Input Current (A and B)
IA,B
DE = GND,
VCC = GND or +3.6V
VIN = +12V
1000
F
A
VIN = -7V
-800
Differential Input Capacitance
CA,B
Between A and B, DE = GND, f = 2MHz
12
pF
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