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參數(shù)資料
| 型號： | MAX14764ETA+T |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 6/13頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC ANALOG SWITCH |
| 產(chǎn)品培訓(xùn)模塊： | Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 電路： | 2 x SPST |
| 導(dǎo)通狀態(tài)電阻： | 20 歐姆 |
| 電壓電源： | 單電源 |
| 電壓 - 電源，單路/雙路(±)： | 3 V ~ 5.5 V |
| 電流 - 電源： | 4.1mA |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 10-WFDFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 10-TDFN-EP（3x3） |
| 包裝： | 帶卷 (TR) |
2
MAX14760/MAX14762/MAX14764
Above- and Below-the-Rails
Low-Leakage Analog Switches
(All voltages referenced to GND, unless otherwise noted.)
VCC..........................................................................-0.3V to +6V
EN, EN1, EN2, SEL ................................ -0.3V to +(VCC + 0.3V)
A, A1, A2, B, B1, B2, COM ................... (VN - 0.3V) to Lesser of
(VP + 0.3V) or (VN + 52V)
VP ................................ -0.3V to Lesser of (+52V) or (VN + 70V)
VN ........................Greater of (VCC - 40V) or (VP - 70V) to +0.3V
VP to VN................................................................... -0.3V to 70V
Continuous Current ......................................................... Q25mA
Continuous Power Dissipation (TA = +70NC)
8-Pin TDFN Package (derate 24.4mW/NC
above +70NC)..........................................................1951.2mW
10-Pin TDFN Package (derate 24.4mW/NC
above +70NC)..........................................................1951.2mW
Operating Temperature Range.......................... -40NC to +85NC
Storage Temperature Range............................ -65NC to +160NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
8 TDFN
Junction-to-Ambient Thermal Resistance (
qJA)...........41°C/W
Junction-to-Case Thermal Resistance (
qJC)..................8°C/W
10 TDFN
Junction-to-Ambient Thermal Resistance (
qJA)...........41°C/W
Junction-to-Case Thermal Resistance (
qJC)..................9°C/W
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
ELECTRICAL CHARACTERISTICS
(VCC = 3.0V to 5.5V, TA = -40NC to +85NC, unless otherwise noted. Typical values are at VCC = 5V, and TA = +25NC.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS
Power Supply Range
VCC
3.0
5.5
V
Continuous Current Through
Switch
IA
-25
+25
mA
Supply Current
ICC
VCC P 4.7V
VEN_= VCC
4.1
10
mA
VEN_= VCC/2
4.1
10
VCC > 4.7V
VEN_= VCC
2.5
6
VEN_= VCC/2
2.5
6
Analog Signal Range
VCOM,
VA_, VB_
Switch open or closed
-25
+25
V
On-Resistance
RON
ICOM or IB_ = Q25mA, VA_= Q25V
8
20
I
On-Resistance Flatness
D
RON
-25V < VA_< +25V, ICOM or IB_ = Q25mA
58
mI
A, A1, A2 Off-Leakage Current
IA_(OFF)
VA_ = +25V, VCOM or VB_= 0V, Figure 1
-30
+30
nA
COM, B, B1, B2 Off-Leakage
Current
ICOM(OFF),
IB_(OFF)
VCOM or VB_ = 15V, VA_ = 0V, Figure 1
(MAX14764)
-10
+10
nA
VB_ = 15V, VA_ = 0V, Figure 1 (MAX14760/
MAX14762)
-10
+10
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