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參數(shù)資料
| 型號： | MAX1446EHJ+ |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 9/20頁 |
| 文件大小： | 0K |
| 描述： | IC ADC 10BIT 60MSPS 32-TQFP |
| 產品培訓模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標準包裝： | 360 |
| 位數(shù)： | 10 |
| 采樣率（每秒）： | 60M |
| 數(shù)據(jù)接口： | 并聯(lián) |
| 轉換器數(shù)目： | 1 |
| 電壓電源： | 單電源 |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 32-TQFP |
| 供應商設備封裝： | 32-TQFP（5x5） |
| 包裝： | 托盤 |
| 輸入數(shù)目和類型： | 2 個單端，雙極；1 個差分，雙極 |
| 產品目錄頁面： | 1397 (CN2011-ZH PDF) |
MAX1446
10-Bit, 60Msps, 3.0V, Low-Power
ADC with Internal Reference
______________________________________________________________________________________
17
Grounding, Bypassing,
__________________and Board Layout
The MAX1446 requires high-speed board layout design
techniques. Locate all bypass capacitors as close to
the device as possible, preferably on the same side as
the ADC, using surface-mount devices for minimum
inductance. Bypass VDD, REFP, REFN, and COM with
two parallel 0.1F ceramic capacitors and a 2.2F
bipolar capacitor to GND. Follow the same rules to
bypass the digital supply (OVDD) to OGND. Multilayer
boards with separated ground and power planes pro-
duce the highest level of signal integrity. Consider
using a split ground plane arranged to match the physi-
cal location of the analog ground (GND) and the digital
output driver ground (OGND) on the ADC's package.
The two ground planes should be joined at a single
point so that the noisy digital ground currents do not
interfere with the analog ground plane. The ideal loca-
tion of this connection can be determined experimen-
tally at a point along the gap between the two ground
planes that produces optimum results. Make this con-
nection with a low-value, surface-mount resistor (1
Ω to
5
Ω), a ferrite bead, or a direct short. Alternatively, all
REFOUT
29
N.C.
REFIN
31
REFP
32
REFN
1
COM
2
0.1
μF
0.1
μF
0.1
μF
330
μF
6V
330
μF
6V
330
μF
6V
10
μF
6V
11
4
3
2
3
1
2
1
MAX1446
N = 1
MAX6066
1/4 MAX4252
REFOUT
29
N.C.
REFIN
31
REFP
32
REFN
1
COM
2
0.1
μF
0.1
μF
0.1
μF
MAX1446
N = 32
47
Ω
2.0V AT 8mA
1.47k
Ω
21.5k
Ω
3.3V
1
μF
21.5k
Ω
21.5k
Ω
21.5k
Ω
21.5k
Ω
NOTE: ONE FRONT-END REFERENCE CIRCUIT DESIGN MAY BE USED WITH UP TO 32 ADCs.
2.2
μF
10V
0.1
μF
0.1
μF
3.3V
2.0V
10
μF
6V
11
4
5
6
7
1/4 MAX4252
47
Ω
1.5V AT 0mA
1.47k
Ω
3.3V
10
μF
6V
11
4
10
9
8
1/4 MAX4252
47
Ω
1.0V AT -8mA
1.47k
Ω
3.3V
MAX4254 POWER-SUPPLY BYPASSING.
PLACE CAPACITOR AS CLOSE AS
POSSIBLE TO THE OP AMP.
0.1
μF
1.5V
1.0V
Figure 11. Unbuffered External Reference Drives Up to 32 ADCs
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參數(shù)描述 |
|---|---|
| MAX1446EHJ+ | 功能描述:模數(shù)轉換器 - ADC 10-Bit 60Msps 3V High Speed ADC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結構:Sigma-Delta 轉換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-32 |
| MAX1446EHJ+T | 功能描述:模數(shù)轉換器 - ADC 10-Bit 60Msps 3V High Speed ADC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結構:Sigma-Delta 轉換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-32 |
| MAX1446EHJ-T | 功能描述:模數(shù)轉換器 - ADC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結構:Sigma-Delta 轉換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-32 |
| MAX1446GHJ+ | 功能描述:模數(shù)轉換器 - ADC 10-Bit 60Msps 3V High Speed ADC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結構:Sigma-Delta 轉換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-32 |
| MAX1446GHJ+T | 功能描述:模數(shù)轉換器 - ADC 10-Bit 60Msps 3V High Speed ADC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結構:Sigma-Delta 轉換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-32 |
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