100/120
參數(shù)資料
型號(hào): MAX13450EAUD+
廠商: Maxim Integrated Products
文件頁(yè)數(shù): 10/17頁(yè)
文件大?。?/td> 0K
描述: TXRX RS-485 14TSSOP
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 96
類型: 收發(fā)器
驅(qū)動(dòng)器/接收器數(shù): 1/1
規(guī)程: RS485
電源電壓: 4.75 V ~ 5.25 V
安裝類型: 表面貼裝
封裝/外殼: 14-TSSOP (0.173",4.40mm 寬)裸露焊盤
供應(yīng)商設(shè)備封裝: 14-TSSOP-EP
包裝: 管件
RS-485 Transceivers with Integrated
100/120 Termination Resistors
MAX13450E/MAX13451E
2 ______________________________________________________________________________________
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND.)
VCC, VL ...................................................................-0.3V to +6V
DE, RE, DI, RO, TERM, TERM100, SRL ..... -0.3V to (VL + 0.3V)
INV, FAULT ................................................. -0.3V to (VL + 0.3V)
A, B, Z, Y ..................................................................-8V to +13V
A to B (High-Z State) ......................................................... +14V
B to A (High-Z State) ......................................................... +14V
Short-Circuit Duration (RO, Y, Z) to GND ................ Continuous
Continuous Power Dissipation (TA = +70NC)
TSSOP (derate 25.6mW/NC above +70NC)................2051mW
Operating Temperature Range ....................... -40NC to +125NC
Storage Temperature Range .......................... -65NC to +150NC
Junction Temperature ....................................................+150NC
Lead Temperature (soldering, 10s) ...............................+300NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(VCC = +4.5V to +5.5V, VL = +1.62V to VCC, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = +5V,
VL = +1.8V, and TA = +25NC.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TSSOP
Junction-to-Ambient Thermal Resistance (
qJA) ..........39°C/W
Junction-to-Case Thermal Resistance (
qJC) .................3°C/W
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
VCC
4.5
5.5
V
Logic Supply Voltage
VL
1.62
1.8
VCC
V
Supply Current
ICC
DE = RE = high, TERM = high, no load
6
mA
DE = RE = low, TERM = low, no load
12
Logic Supply Current
IL
Current into VL, no load on RO, device not
switching, DE = RE = high
2
F
A
Shutdown Current
ISHDN
Current into VCC, DE = low, RE = TERM =
high
30
F
A
Current into VCC, DE = low, RE = high,
TERM = low
8
mA
DRIVER
Differential Driver Output
VOD
RDIFF = 100I, Figure 1 (Note 3)
2.0
VCC
V
RDIFF = 46I, Figure 1 (Note 3)
1.5
VCC
Change in Magnitude of
Differential Output Voltage
D
VOD
RDIFF = 100I or 46I, Figure 1 (Note 3)
0.2
V
Driver Common-Mode Output
Voltage
VOC
RDIFF = 100I or 46I, Figure 1 (Note 3)
VCC/2
3
V
Change In Magnitude of
Common-Mode Voltage
D
VOC
RDIFF = 100I or 46I, Figure 1 (Note 3)
0.2
V
Driver Short-Circuit Output
Current
IOSD
0V P VOUT P +12V
+280
mA
-7V P VOUT P 0V
-250
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