參數(shù)資料
型號(hào)： MAX13058EEWG+T
廠商： Maxim Integrated Products
文件頁(yè)數(shù)： 7/14頁(yè)
文件大?。?/td> 0K
描述： IC LEVEL TRANSLATOR 8CH 28-TQFN
產(chǎn)品培訓(xùn)模塊： Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝： 2,500
邏輯功能： 變換器，雙向，開路漏極
位數(shù)： 8
輸入類型： 電壓
輸出類型： 電壓
通道數(shù)： 8
輸出/通道數(shù)目： 1
差分 - 輸入:輸出： 無(wú)/無(wú)
工作溫度： -40°C ~ 85°C
封裝/外殼： 24-WFBGA，WLCSP
供應(yīng)商設(shè)備封裝： 24-WLP
包裝： 帶卷 (TR)
MAX13055E–MAX13058E
1.62V to 3.6V, 8-Channel, High-Speed LLT
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(Voltages referenced to GND.)
VCC, VL .............................................................................-0.3V to +4.0V
EN..........................................................................-0.3V to +4.0V
I/O VCC_ .....................................................-0.3V to (VCC + 0.3V)
I/O VL_ ...........................................................-0.3V to (VL + 0.3V)
Short-Circuit Duration
I/O to GND..................................................................Continuous
Continuous Power Dissipation (TA = +70°C)
28-Pin TQFN (derate 28.6mW/°C above +70°C) .......2286mW
Junction-to-Case Thermal Resistance (
θJC) (Note 1)
28-Pin TQFN................................................................2.7°C/W
Junction-to-Ambient Thermal Resistance (
θJA) (Note 1)
24-Bump WLP ..............................................................97°C/W
28-Pin TQFN.................................................................35°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
ELECTRICAL CHARACTERISTICS
(VCC = +2.2V to +3.6V, VL = +1.62V to +3.2V, EN = VL, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +3.3V,
VL = +1.8V, and TA = +25°C.) (Notes 2, 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
VL Supply Range
VL
1.62
3.2
V
VCC Supply Range
VCC
2.2
3.6
V
Supply Current from VCC
IQVCC
I/O VCC_ = VCC, I/O VL_ = VL
40
A
Supply Current from VL
IQVL
I/O VCC_ = VCC, I/O VL_ = VL
10
A
VCC Shutdown Supply Current
ISHDN-VCC
TA = +25°C, EN = GND
0.1
2
A
TA = +25°C, EN = GND
0.1
1
VL Shutdown Mode Supply
Current
ISHDN-VL
TA = +25°C, EN = VL, VCC = 0V
0.1
4
A
I/O Three-State Leakage Current
ILEAK
TA = +25°C, EN = GND
0.1
2
A
EN Input Leakage Current
ILEAK_EN
TA = +25
oC1
A
VL - VCC Shutdown Threshold HighVTH_H
VCC rising
0
0.1 x VL
0.8
V
VL - VCC Shutdown Threshold Low
VTH_L
VCC falling
0
0.12 x VL
0.8
V
I/O VCC_ Pulldown Resistance
During Shutdown
RVCC_PD_SD MAX13056E/MAX13058E
10
16.5
23
k
Ω
I/O VL_ Pulldown Resistance
During Shutdown
RVL_PD_SD
MAX13057E/MAX13058E
10
16.5
23
k
Ω
I/O VL_ Pullup Current
(Normal Mode)
IVL_PU_
I/O VL_ = GND, I/O VCC_ = GND
20
65
A
I/O VCC_ Pullup Current
(Normal Mode)
IVCC_PU_
I/O VCC_ = GND, I/O VL_ = GND
20
65
A
I/O VL_ to I/O VCC_ DC Resistance
RIOVL_IOVCC
3k
Ω
ESD PROTECTION
All Ports
Human Body Model
+2kV
Human Body Model
+15
IEC 61000-4-2 Air-Gap Discharge, CVCC = 1F
+15
I/O VCC_ Only
IEC 61000-4-2 Contact Discharge, CVCC = 1F
+8
kV
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
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