VDD
參數(shù)資料
型號(hào): MAX11131EVKIT#
廠(chǎng)商: Maxim Integrated Products
文件頁(yè)數(shù): 12/37頁(yè)
文件大小: 0K
描述: EVAL KIT MAX11131
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 1
ADC 的數(shù)量: 1
位數(shù): 12
采樣率(每秒): 3M
數(shù)據(jù)接口: 串行
輸入范圍: 2.5 Vpp
在以下條件下的電源(標(biāo)準(zhǔn)): 15.2mW @ 3Msps,3V
工作溫度: -40°C ~ 125°C
已用 IC / 零件: MAX11131
已供物品:
2
Maxim Integrated
MAX11129–MAX11132
3Msps, Low-Power, Serial 12-/10-Bit,
8-/16-Channel ADCs
VDD to GND.............................................................-0.3V to +4V
OVDD, AIN0–AIN13, CNVST/AIN14, REF+, REF-/AIN15
to GND......................-0.3V to the lower of (VDD + 0.3V) and +4V
CS, SCLK, DIN, DOUT, EOC TO GND ..... -0.3V to the Lower of
(VOVDD + 0.3V) and +4V
DGND to GND......................................................-0.3V to +0.3V
Input/Output Current (all pins) ...........................................50mA
Continuous Power Dissipation (TA = +70NC)
TQFN (derate 34.4mW/NC above +70NC)..................2758mW
TSSOP (derate 27mW/NC above +70NC)...................2162mW
Operating Temperature Range........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
TQFN
Junction-to-Ambient Thermal Resistance (BJA)...........29NC/W
Junction-to-Case Thermal Resistance (BJC)..................2NC/W
TSSOP
Junction-to-Ambient Thermal Resistance (BJA)...........37NC/W
Junction-to-Case Thermal Resistance (BJC)..................2NC/W
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
ELECTRICAL CHARACTERISTICS (MAX11131/MAX11132)
(VDD = 2.35V to 3.6V, VOVDD = 1.5V to 3.6V, fSAMPLE = 3Msps, fSCLK = 48MHz, 50% duty cycle, VREF+ = VDD, TA = -40NC to +125NC,
unless otherwise noted. Typical values are at TA = +25NC.) (Note 2)
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC ACCURACY (Notes 3 and 4)
Resolution
RES
12 bit
12
Bits
Integral Nonlinearity
INL
±1.0
LSB
Differential Nonlinearity
DNL
No missing codes
±1.0
LSB
Offset Error
-0.1
±4.0
LSB
Gain Error
(Note 5)
+0.3
±4.0
LSB
Offset Error Temperature
Coefficient
OETC
±2
ppm/NC
Gain Temperature Coefficient
GETC
±0.8
ppm/NC
Channel-to-Channel Offset
Matching
±0.5
LSB
Line Rejection
PSR
(Note 6)
±0.5
±2
LSB/V
DYNAMIC PERFORMANCE (500kHz, input sine wave) (Notes 3 and 7)
Signal-to-Noise Plus Distortion
SINAD
70
72.2
dB
Signal-to-Noise Ratio
SNR
70
72.3
dB
Total Harmonic Distortion
(Up to the 5th Harmonic)
THD
-88
-78
dB
Spurious-Free Dynamic Range
SFDR
79
90
dB
Intermodulation Distortion
IMD
f1 = 398.4375kHz, f2 = 275.8125kHz
-85
dB
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