參數(shù)資料
型號(hào)： MAX1030BCTI+T
廠商： Maxim Integrated Products
文件頁(yè)數(shù)： 11/22頁(yè)
文件大?。?/td> 0K
描述： IC ADC 10BIT 300KSPS 28-TQFN-EP
產(chǎn)品培訓(xùn)模塊： Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝： 2,500
位數(shù)： 10
采樣率（每秒）： 300k
數(shù)據(jù)接口： MICROWIRE?，QSPI?，串行，SPI?
轉(zhuǎn)換器數(shù)目： 1
功率耗散（最大）： 1.67W
電壓電源： 單電源
工作溫度： 0°C ~ 70°C
安裝類型： 表面貼裝
封裝/外殼： 28-WFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝： 28-TQFN-EP（5x5）
包裝： 帶卷 (TR)
輸入數(shù)目和類型： 16 個(gè)單端，單極；16 個(gè)單端，雙極；8 個(gè)差分，單極；8 個(gè)差分，雙極
MAX1026/MAX1028/MAX1030
10-Bit 300ksps ADCs with FIFO,
Temp Sensor, Internal Reference
______________________________________________________________________________________
19
Externally Clocked Acquisitions and
Conversions Using the Serial Interface
Performing Conversions in Clock Mode 11
In clock mode 11, acquisitions and conversions are ini-
tiated by writing to the conversion register and are per-
formed one at a time using the SCLK as the conversion
clock. Scanning and averaging are disabled, and the
conversion result is available at DOUT during the con-
version. See Figure 7 for clock mode 11 timing.
Initiate a conversion by writing a byte to the conversion
register followed by 16 SCLK cycles. If
CS is pulsed
high between the eighth and ninth cycles, the pulse
width must be less than 100μs. To continuously convert
at 16 cycles per conversion, alternate 1 byte of zeros
between each conversion byte.
If reference mode 00 is requested, or if an external refer-
ence is selected but a temperature measurement is
being requested, wait 65μs with
CS high after writing the
conversion byte to extend the acquisition and allow the
internal reference to power up. To perform a temperature
measurement, write 24 bytes (192 cycles) of zeros after
the conversion byte. The temperature result appears on
DOUT during the last 2 bytes of the 192 cycles.
Partial Reads and Partial Writes
If the first byte of an entry in the FIFO is partially read
(
CS is pulled high after fewer than eight SCLK cycles),
the second byte of data that is read out contains the
next 8 bits (not b7–b0). The remaining bits are lost for
that entry. If the first byte of an entry in the FIFO is read
out fully, but the second byte is read out partially, the
rest of the entry is lost. The remaining data in the FIFO
is uncorrupted and can be read out normally after tak-
ing
CS low again, as long as the 4 leading bits (normal-
ly zeros) are ignored. Internal registers that are written
partially through the SPI contain new values, starting at
the MSB up to the point that the partial write is stopped.
The part of the register that is not written contains previ-
ously written values. If
CS is pulled low before EOC
goes low, a conversion cannot be completed and the
FIFO is corrupted.
Transfer Function
Figure 8 shows the unipolar transfer function for single-
ended or differential inputs. Figure 9 shows the bipolar
transfer function for differential inputs. Code transitions
occur halfway between successive-integer LSB values.
Output coding is binary, with 1 LSB = VREF / 1024V for
unipolar and bipolar operation, and 1 LSB = 0.125°C
for temperature measurements.
Layout, Grounding, and Bypassing
For best performance, use PC boards. Do not use wire-
wrap boards. For the TQFN package, connect its
exposed pad to GND. Board layout should ensure that
digital and analog signal lines are separated from each
other. Do not run analog and digital (especially clock)
signals parallel to one another or run digital lines under-
neath the MAX1026/MAX1028/MAX1030 package. High-
frequency noise in the VDD power supply can affect
performance. Bypass the VDD supply with a 0.1μF
capacitor to GND, close to the VDD pin. Minimize
capacitor lead lengths for best supply-noise rejection. If
the power supply is very noisy, connect a 10
Ω resistor in
series with the supply to improve power-supply filtering.
CS
DOUT
SCLK
DIN
EOC
MSB1
LSB1
MSB2
(ACQUISITION1)
(ACQUISITION2)
(CONVERSION1)
(CONVERSION BYTE)
EXTERNALLY TIMED ACQUISITION, SAMPLING AND CONVERSION WITHOUT CNVST. X = DON'T CARE.
Figure 7. Clock Mode 11
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參數(shù)描述
MAX1030BEEG 功能描述:模數(shù)轉(zhuǎn)換器 - ADC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
MAX1030BEEG+ 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 10Bit 300ksps w/FIFO Temp Sensor Int Ref RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
MAX1030BEEG+T 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 10Bit 300ksps w/FIFO Temp Sensor Int Ref RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
MAX1030BEEG-T 功能描述:模數(shù)轉(zhuǎn)換器 - ADC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
MAX1030BEGI-T 制造商:MAXIM 制造商全稱:Maxim Integrated Products 功能描述:10-Bit 300ksps ADCs with FIFO, Temp Sensor, Internal Reference
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