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參數(shù)資料
| 型號(hào)： | MADP-000235-10720T |
| 元件分類： | PIN二極管 |
| 英文描述： | SILICON, PIN DIODE |
| 封裝： | ROHS COMPLIANT, HERMETIC SEALED, CERAMIC, CASE 1072, 2 PIN |
| 文件頁(yè)數(shù)： | 3/3頁(yè) |
| 文件大小： | 151K |
| 代理商： | MADP-000235-10720T |
North America Tel: 800.366.2266 / Fax: 978.366.2266
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.
Non-Magnetic MELF PIN Diode
RoHS Compliant
MADP-000235-10720T
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
volume is not guaranteed.
A
B
C
Solderable
Surfaces
Cathode
Case Style
A (sq)
Min./Max.
B
Min./Max.
C
Min./Max.
1072
0.080/0.095
(2.032/2.413)
0.115/0.135
(2.921/3.429)
0.008/0.030
(.203/.762)
Size Inches (mm)
All tolerances are ± .001” (± .025 mm).
Cleanliness and Storage
These devices should be handled and stored in a clean environment.
Ends of the device are tin plated for greater solderability.
Continuous exposure to high humidity (>80%) for extended periods may cause the surface to oxidize.
Caution should be taken when storing devices for long periods.
ESD
These devices are susceptible to ESD and are rated Class 2, HBM.
General Handling
Device can be handled with tweezers or vacuum pickups and are suitable for use with automatic pick-and-
place equipment.
MELF Assembly Recommendations
Devices may be soldered using standard 60Sn/40Pb or RoHS compliant solders. MELF devices are tin plated
50 μM thick to ensure an optimum connection.
For recommended Sn/Pb and RoHS soldering profiles See Application Note M538 on the M/A-COM website.
Circuit Pad Layout
B
C
A
Dimension
Package Style
1072
inches
mm
A
0.093
2.36
B
0.050
1.27
C
0.060
1.52
1072 Package Dimensions
Ordering Information
(Diodes are available in tape and reel in quantities shown below)
Package Style
Quantity 7” Reel
1072T
1500
Tape and reel information can be found on the M/A-COM website at
http://www.macom.com/Application%20Notes/pdf/M513.pdf
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