參數(shù)資料
型號(hào): MA4P1250
元件分類: 參考電壓二極管
英文描述: 50 V, SILICON, PIN DIODE
文件頁數(shù): 1/3頁
文件大?。?/td> 143K
代理商: MA4P1250
Surface Mount
PIN Diodes
MA4P1250, MA4P1450 SMQ
V3.00
M/A-COM, Inc.
North America:
Tel. (800) 366-2266
s
Asia/Pacic: Tel. +81 3 3263 8761
s
Europe: Tel. +44 (1344) 869 595
Fax (800) 618-8883
Fax +81 3 3263 8769
Fax +44 (1344) 300 020
1
Specications Subject to Change Without Notice.
Features
q
Non-Rollable MELF Design
q
Hermetically Sealed
q
Low Loss, Low Distortion
q
Passivated PIN Diode Chips
q
Full Face Chip Bonds
q
Non-Magnetic Package
q
Pick and Place Compatibility
Description
The MA4P1250 and MA4P1450 are square surface mount-
able PIN diodes in a non-rollable, metal electrode lead-
less faced (MELF) package. They incorporate passivated
PIN diode chips that are full face bonded to refractory
metal pins. These parts utilize M/A-COM’s HIPAX tech-
nology in a low inductance ceramic package with no rib-
bons or whisker wires. The package is hermetically
sealed at temperatures exceeding 300C.
Applications
The MA4P1250 is designed for use as a low loss switch-
ing element from HF through UHF. Its high power rating
allows performance in antenna switch elements at RF
power levels greater than 100 watts CW. It is designed to
meet the low distortion requirements of mobile radios.
The MA4P1450 is a higher power diode. It has lower dis-
tortion at RF CW power greater than 10 watts and can
dissipate 7.5 watts.
Designed for Automated Assembly
These surface mount PIN diodes are designed for high
volume tape and reel assembly. The square package
eases automatic pick and place indexing and assembly.
The parallel at surfaces are suitable for key jaw or vac-
uum pickup techniques. All solderable surfaces are tin
plated and compatible with reow and vapor phase sol-
dering methods.
Environmental Capability
These HIPAX diodes are applicable for use in industrial
and military applications. They can meet the environmen-
tal requirements of MIL-STD-750 and MIL-STD-202 or be
screened to JAN-TX and other high reliability standards.
SOLDERABLE
SURFACES
CERAMIC
FULL FACE
BOND
PASSIVATED
PIN DIODE CHIP
Size, Inches (mm)
Case
A(sq.)
B
C
Model No.
Style
Min./Max.
MA4P1250
1072
0.080/0.095
0.115/0.135
0.008/0.030
(2.03/2.41)
(2.92/3.43)
(0.203/0.762)
MA4P1450
1091
0.138/0.155
0.180/0.200
(3.51/3.94)
(4.57/5/08)
SMQ is a trademark of M/A-COM, Inc.
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