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Visit www.macom.com for additional data sheets and product information.
M/A-COM Technical Solutions and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice.
1
GaAs Constant Gamma Flip-Chip
Varactor Diode
M/A-COM Products
Rev. V1
MA46H120 Series
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technical Solutions is
considering for development. Performance is based on target specifications, simulated results, and/
or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technical Solutions
has under development. Performance is based on engineering tests. Specifications are typical.
Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit-
ment to produce in volume is not guaranteed.
Features
Constant Gamma for Linear Tuning
Low Parasitic Capacitance
High Q
Silicon Nitride Passivation
Polyimide Scratch Protection
Surface Mount Configuration
Description
M/A-COM’s MA46H120 series is a gallium
arsenide flip chip hyperabrupt varactor
diode. These devices are fabricated on
OMCVD epitaxial wafers using a process
designed for high device uniformity and
extremely low parasitics. The MA46H120
diodes are fully passivated with silicon
nitride and have an additional layer of
polyimide
for
scratch
protection.
The
protective coatings prevent damage to the
junction
during
automated
or
manual
handling. The flip chip configuration is
suitable for pick and place insertion.
Ordering Information
Part Number
Package
MA46H120-W
Whole Wafer
MA46H120
Gel Pack
MAVR-000120-12030W
Waffle Pack
MAVR-000120-12030T
Surf Tape
Absolute Maximum Ratings
1,2
Operating Temperature
-40°C to +125°C
Storage Temperature
-65°C to +150°C
Power Dissipation
100 mW
Mounting Temperature
+235°C for 10 seconds
1.
Exceeding any one or combination of these limits may cause
permanent damage to this device.
2.
M/A-COM does not recommend sustained operation near
these survivability limits.
* Specifications are subject to change without prior notification
Chip Layout
Front View (Circuit Side)
Back View (Operator Side)
Schematic