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參數(shù)資料
| 型號(hào)： | M74VHC1GU04DTT1G |
| 廠商： | ON Semiconductor |
| 文件頁(yè)數(shù)： | 6/6頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC INVERTER SGL UNBUFFER 5TSOP |
| 標(biāo)準(zhǔn)包裝： | 3,000 |
| 系列： | 74VHC |
| 邏輯類型： | 反相器 |
| 電路數(shù)： | 1 |
| 輸入數(shù)： | 1 |
| 電源電壓： | 2 V ~ 5.5 V |
| 電流 - 靜態(tài)（最大值）： | 1µA |
| 輸出電流高，低： | 8mA，8mA |
| 邏輯電平 - 低： | 0.3 V ~ 1.1 V |
| 邏輯電平 - 高： | 1.7 V ~ 4.4 V |
| 額定電壓和最大 CL 時(shí)的最大傳播延遲： | 7ns @ 4.5V ~ 5.5V，50pF |
| 工作溫度： | -55°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 供應(yīng)商設(shè)備封裝： | 5-TSOP |
| 封裝/外殼： | 6-TSOP（0.059"，1.50mm 寬）5 引線 |
| 包裝： | 帶卷 (TR) |
MC74VHC1GU04
http://onsemi.com
6
PACKAGE DIMENSIONS
TSOP5
CASE 48302
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
MIN
MAX
MILLIMETERS
A
3.00 BSC
B
1.50 BSC
C
0.90
1.10
D
0.25
0.50
G
0.95 BSC
H
0.01
0.10
J
0.10
0.26
K
0.20
0.60
L
1.25
1.55
M
0
10
S
2.50
3.00
12
3
54
S
A
G
L
B
D
H
C
J
__
0.7
0.028
1.0
0.039
mm
inches
SCALE 10:1
0.95
0.037
2.4
0.094
1.9
0.074
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.20
5X
C AB
T
0.10
2X
T
0.20
NOTE 5
T
SEATING
PLANE
0.05
K
M
DETAIL Z
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
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Phone: 81357733850
MC74VHC1GU04/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 3036752175 or 8003443860 Toll Free USA/Canada
Fax: 3036752176 or 8003443867 Toll Free USA/Canada
Email: orderlit@onsemi.com
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For additional information, please contact your local
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