參數(shù)資料
型號: M74VHC1G125
廠商: ON SEMICONDUCTOR
英文描述: Noninverting 3-State Buffer(非反相三態(tài)緩沖器)
中文描述: 同相三態(tài)緩沖器(非反相三態(tài)緩沖器)
文件頁數(shù): 2/6頁
文件大?。?/td> 79K
代理商: M74VHC1G125
MC74VHC1G125
http://onsemi.com
2
MAXIMUM RATINGS
Symbol
Characteristics
Value
Unit
V
CC
DC Supply Voltage
0.5 to +7.0
V
V
IN
DC Input Voltage
0.5 to +7.0
V
V
OUT
DC Output Voltage
V
= 0
High or Low State
0.5 to 7.0
0.5 to V
CC
+ 0.5
V
I
IK
Input Diode Current
20
mA
I
OK
Output Diode Current
V
OUT
< GND; V
OUT
> V
CC
+20
mA
I
OUT
DC Output Current, per Pin
+25
mA
I
CC
DC Supply Current, V
CC
and GND
+50
mA
P
D
Power Dissipation in Still Air
SC88A, TSOP5
200
mW
JA
Thermal Resistance
SC88A, TSOP5
333
°
C/W
T
L
Lead Temperature, 1 mm from Case for 10 secs
260
°
C
T
J
Junction Temperature Under Bias
+150
°
C
T
stg
Storage Temperature
65 to +150
°
C
V
ESD
ESD Withstand Voltage
Human Body Model (Note 1)
Machine Model (Note 2)
Charged Device Model (Note 3)
> 2000
> 200
N/A
V
I
Latchup
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Tested to EIA/JESD22A114A.
2. Tested to EIA/JESD22A115A.
3. Tested to JESD22C101A.
4. Tested to EIA/JESD78.
Latchup Performance
Above V
CC
and Below GND at 125
°
C (Note 4)
500
mA
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
Max
Unit
V
CC
DC Supply Voltage
2.0
5.5
V
V
IN
DC Input Voltage
0.0
5.5
V
V
OUT
DC Output Voltage
0.0
V
CC
V
T
A
Operating Temperature Range
55
+125
°
C
t
r
, t
f
Input Rise and Fall Time
V
CC
= 3.3 V
V
CC
= 5.0 V
0.3 V
0.5 V
0
0
100
20
ns/V
Device Junction Temperature versus
Time to 0.1% Bond Failures
Junction
Temperature
°
C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
1
1
10
100
1000
TIME, YEARS
N
T
°
T
°
T
°
T
°
T
°
T
°
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Figure 3. Failure Rate vs. Time Junction Temperature
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