參數(shù)資料
型號(hào): M391T3253FG0-CD5
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: DDR2 Unbuffered SDRAM MODULE
中文描述: 無緩沖DDR2的內(nèi)存模塊
文件頁數(shù): 16/20頁
文件大?。?/td> 382K
代理商: M391T3253FG0-CD5
Rev. 1.3 Aug. 2005
256MB, 512MB Unbuffered DIMMs
DDR2 SDRAM
Electrical Characteristics & AC Timing for DDR2-667/533/400 SDRAM
(0
°
C < T
CASE
< 95
°
C; V
DDQ
= 1.8V + 0.1V; V
DD
= 1.8V + 0.1V)
Refresh Parameters by Device Density
Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin
Timing Parameters by Speed Grade
(Refer to notes for informations related to this table at the bottom)
Parameter
Symbol
256Mb
512Mb
1Gb
2Gb
4Gb
Units
Refresh to active/Refresh command time
tRFC
75
105
127.5
195
tbd
ns
Average periodic refresh interval
tREFI
0
°
C
T
CASE
85
°
C
7.8
7.8
7.8
7.8
7.8
μ
s
85
°
C
<
T
CASE
95
°
C
3.9
3.9
3.9
3.9
3.9
μ
s
Speed
DDR2-667(E6)
DDR2-533(D5)
DDR2-400(CC)
Units
Bin (CL - tRCD - tRP)
5 - 5- 5
4 - 4 - 4
3 - 3 - 3
Parameter
min
max
min
max
min
max
tCK, CL=3
5
8
5
8
5
8
ns
tCK, CL=4
3.75
8
3.75
8
5
8
ns
tCK, CL=5
3
8
-
-
-
-
ns
tRCD
15
15
15
ns
tRP
15
15
15
ns
tRC
54
55
55
ns
tRAS
39
70000
40
70000
40
70000
ns
Parameter
Symbol
DDR2-667
DDR2-533
DDR2-400
Units
Notes
min
max
min
max
min
max
DQ output access time from CK/CK
tAC
-450
+450
-500
+500
-600
+600
ps
DQS output access time from CK/CK
tDQSCK
-400
+400
-450
+450
-500
+500
ps
CK high-level width
tCH
0.45
0.55
0.45
0.55
0.45
0.55
tCK
CK low-level width
tCL
0.45
0.55
0.45
0.55
0.45
0.55
tCK
CK half period
tHP
min(tCL,
tCH)
x
min(tCL,
tCH)
x
min(tCL,
tCH)
x
ps
20,21
Clock cycle time, CL=x
tCK
3000
8000
3750
8000
5000
8000
ps
24
DQ and DM input hold time
tDH
175
x
225
x
275
x
ps
15,16,17
DQ and DM input setup time
tDS
50
x
100
x
150
x
ps
15,16,17
Control & Address input pulse width for each input
tIPW
0.6
x
0.6
x
0.6
x
tCK
DQ and DM input pulse width for each input
tDIPW
0.35
x
0.35
x
0.35
x
tCK
Data-out high-impedance time from CK/CK
tHZ
x
tAC max
x
tAC max
x
tAC max
ps
DQS low-impedance time from CK/CK
tLZ(DQS)
tAC min
tAC max
tAC min
tAC max
tAC min
tAC max
ps
27
DQ low-impedance time from CK/CK
tLZ(DQ)
2*tAC min
tAC max
2* tACmin
tAC max
2* tACmin
tAC max
ps
27
DQS-DQ skew for DQS and associated DQ signals
tDQSQ
x
250
x
300
x
350
ps
22
DQ hold skew factor
tQHS
x
350
x
400
x
450
ps
21
DQ/DQS output hold time from DQS
tQH
tHP - tQHS
x
tHP - tQHS
x
tHP - tQHS
x
ps
Write command to first DQS latching transition
tDQSS
WL-0.25
WL+0.25
WL-0.25
WL+0.25
WL-0.25
WL+0.25
tCK
DQS input high pulse width
tDQSH
0.35
x
0.35
x
0.35
x
tCK
相關(guān)PDF資料
PDF描述
M391T6453FG0-CD5 DDR2 Unbuffered SDRAM MODULE
M378T6453FZ0 DDR2 Unbuffered SDRAM MODULE
M378T3253FZ0-CE6 DDR2 Unbuffered SDRAM MODULE
M39006 Wet Tantalum Capacitors, Military Established Reliability, MIL-PRF-39006 Qualified Styles CLR65, 69, 79, 81, 90, 91
M39006220660 Wet Tantalum Capacitors, Military Established Reliability, MIL-PRF-39006 Qualified Styles CLR65, 69, 79, 81, 90, 91
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
M391T3253FG0-CE6 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:DDR2 Unbuffered SDRAM MODULE
M391T3253FG0-D5 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:DDR2 Unbuffered SDRAM MODULE
M391T3253FG3-CCC 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:DDR2 Unbuffered SDRAM MODULE
M391T3253FG3-CD5 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:DDR2 Unbuffered SDRAM MODULE
M391T3253FG3-CE6 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:DDR2 Unbuffered SDRAM MODULE