| 型號(hào): | M381L2923BUM-CB3 |
| 廠商: | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述: | DDR SDRAM Unbuffered Module 184pin Unbuffered Module based on 512Mb B-die with 64/72-bit Non ECC/ECC 66 TSOP-II |
| 中文描述: | DDR SDRAM的緩沖模塊184pin緩沖模塊基于512Mb乙芯片與64/72-bit非ECC / ECC的66 TSOP-II |
| 文件頁(yè)數(shù): | 1/25頁(yè) |
| 文件大?。?/td> | 463K |
| 代理商: | M381L2923BUM-CB3 |

相關(guān)PDF資料 |
PDF描述 |
|---|---|
| M381L2923BUM-CCC | DDR SDRAM Unbuffered Module 184pin Unbuffered Module based on 512Mb B-die with 64/72-bit Non ECC/ECC 66 TSOP-II |
| M381L2923BUM-LB3 | DDR SDRAM Unbuffered Module 184pin Unbuffered Module based on 512Mb B-die with 64/72-bit Non ECC/ECC 66 TSOP-II |
| M381L2923BUM-LCC | DDR SDRAM Unbuffered Module 184pin Unbuffered Module based on 512Mb B-die with 64/72-bit Non ECC/ECC 66 TSOP-II |
| M393T2863AZ3 | DDR2 Registered SDRAM MODULE |
| M393T2863AZ3-CC | DDR2 Registered SDRAM MODULE |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| M381L2923CUM-CB300 | 制造商:Samsung Semiconductor 功能描述:512MSDDDR_MDDR SDRAM MODULX72TSOP2-400(LF) - Bulk |
| M381L6423ETM-CA200 | 制造商:Samsung Semiconductor 功能描述:256 DDR SDRAM MODUL X72 TSOP2-400 - Trays |
| M3820 | 功能描述:電纜固定件和配件 LTRSCG 875 BLACK RoHS:否 制造商:Heyco 類(lèi)型:Cable Grips, Liquid Tight 材料:Nylon 顏色:Black 安裝方法:Cable 最大光束直徑:11.4 mm 抗拉強(qiáng)度: |
| M38203 | 制造商:MITSUBISHI 制造商全稱(chēng):Mitsubishi Electric Semiconductor 功能描述:8-BIT SINGLE-CHIP MICROCOMPUTER |
| M38203E4 | 制造商:MITSUBISHI 制造商全稱(chēng):Mitsubishi Electric Semiconductor 功能描述:SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER |