Revision 13 2-81 Timing Characteristics 1.5 V DC Core Voltage 1.2 V DC Core Voltage Table 2-1" />
參數(shù)資料
型號: M1AGLE3000V2-FG896I
廠商: Microsemi SoC
文件頁數(shù): 162/166頁
文件大小: 0K
描述: IC FPGA 1KB FLASH 3M 896-FBGA
標(biāo)準(zhǔn)包裝: 27
系列: IGLOOe
邏輯元件/單元數(shù): 75264
RAM 位總計(jì): 516096
輸入/輸出數(shù): 620
門數(shù): 3000000
電源電壓: 1.14 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 896-BGA
供應(yīng)商設(shè)備封裝: 896-FBGA(31x31)
IGLOOe Low Power Flash FPGAs
Revision 13
2-81
Timing Characteristics
1.5 V DC Core Voltage
1.2 V DC Core Voltage
Table 2-133 Output DDR Propagation Delays
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
Std.
Units
tDDROCLKQ
Clock-to-Out of DDR for Output DDR
1.07
ns
tDDROSUD1
Data_F Data Setup for Output DDR
0.67
ns
tDDROSUD2
Data_R Data Setup for Output DDR
0.67
ns
tDDROHD1
Data_F Data Hold for Output DDR
0.00
ns
tDDROHD2
Data_R Data Hold for Output DDR
0.00
ns
tDDROCLR2Q
Asynchronous Clear-to-Out for Output DDR
1.38
ns
tDDROREMCLR
Asynchronous Clear Removal Time for Output DDR
0.00
ns
tDDRORECCLR
Asynchronous Clear Recovery Time for Output DDR
0.23
ns
tDDROWCLR1
Asynchronous Clear Minimum Pulse Width for Output DDR
0.19
ns
tDDROCKMPWH
Clock Minimum Pulse Width HIGH for the Output DDR
0.31
ns
tDDROCKMPWL
Clock Minimum Pulse Width LOW for the Output DDR
0.28
ns
FDDOMAX
Maximum Frequency for the Output DDR
250.00
MHz
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
Table 2-134 Output DDR Propagation Delays
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V
Parameter
Description
Std.
Units
tDDROCLKQ
Clock-to-Out of DDR for Output DDR
1.60
ns
tDDROSUD1
Data_F Data Setup for Output DDR
1.09
ns
tDDROSUD2
Data_R Data Setup for Output DDR
1.16
ns
tDDROHD1
Data_F Data Hold for Output DDR
0.00
ns
tDDROHD2
Data_R Data Hold for Output DDR
0.00
ns
tDDROCLR2Q
Asynchronous Clear-to-Out for Output DDR
1.99
ns
tDDROREMCLR
Asynchronous Clear Removal Time for Output DDR
0.00
ns
tDDRORECCLR
Asynchronous Clear Recovery Time for Output DDR
0.24
ns
tDDROWCLR1
Asynchronous Clear Minimum Pulse Width for Output DDR
0.19
ns
tDDROCKMPWH
Clock Minimum Pulse Width HIGH for the Output DDR
0.31
ns
tDDROCKMPWL
Clock Minimum Pulse Width LOW for the Output DDR
0.28
ns
FDDOMAX
Maximum Frequency for the Output DDR
160.00
MHz
Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-6 for derating values.
相關(guān)PDF資料
PDF描述
M4A5-256/128-65YC IC CPLD ISP 4A 256MC 208PQFP
M5LV-512/256-7SAI IC CPLD 512MC 256I/O 352SBGA
MAC7131MVF40 IC MCU 32BIT FLASH 208-MAPBGA
MAX1021BETX+ IC ADC/DAC 10BIT W/FIFO 36-TQFN
MAX1042BETX+ IC ADC/DAC 10BIT W/FIFO 36TQFN
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
M1AGLE3000V2-FG896PP 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology
M1AGLE3000V2-FGG484 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOOe 標(biāo)準(zhǔn)包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP(75x75)
M1AGLE3000V2-FGG484I 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOOe 標(biāo)準(zhǔn)包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP(75x75)
M1AGLE3000V2-FGG896 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOOe 標(biāo)準(zhǔn)包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP(75x75)
M1AGLE3000V2-FGG896ES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology