2-6 Revision 23 Package Thermal Characteristics The device junction-to-case thermal resistivity is <" />
鍙冩暩(sh霉)璩囨枡
鍨嬭櫉锛� M1AGL250V5-VQG100I
寤犲晢锛� Microsemi SoC
鏂囦欢闋佹暩(sh霉)锛� 135/250闋�
鏂囦欢澶у皬锛� 0K
鎻忚堪锛� IC FPGA 1KB FLASH 250K 100-VQFP
妯�(bi膩o)婧�(zh菙n)鍖呰锛� 90
绯诲垪锛� IGLOO
閭忚集鍏冧欢/鍠厓鏁�(sh霉)锛� 6144
RAM 浣嶇附瑷堬細 36864
杓稿叆/杓稿嚭鏁�(sh霉)锛� 68
闁€鏁�(sh霉)锛� 250000
闆绘簮闆诲锛� 1.425 V ~ 1.575 V
瀹夎椤炲瀷锛� 琛ㄩ潰璨艰
宸ヤ綔婧害锛� -40°C ~ 85°C
灏佽/澶栨锛� 100-TQFP
渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁濓細 100-VQFP锛�14x14锛�
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IGLOO DC and Switching Characteristics
2-6
Revision 23
Package Thermal Characteristics
The device junction-to-case thermal resistivity is
jc and the junction-to-ambient air thermal resistivity is
ja. The thermal characteristics for ja are shown for two air flow rates. The absolute maximum junction
temperature is 100掳C. EQ 2 shows a sample calculation of the absolute maximum power dissipation
allowed for the AGL1000-FG484 package at commercial temperature and in still air.
EQ 2
Disclaimer:
The simulation for determining the junction-to-air thermal resistance is based on JEDEC standards
(JESD51) and assumptions made in building the model. Junction-to-case is based on SEMI G38-88.
JESD51 is only used for comparing one package to another package, provided the two tests uses the
same condition. They have little relevance in actual application and therefore should be used with a
degree of caution.
Maximum Power Allowed
Max. junction temp. (
C) Max. ambient temp. (C)
鈥�
ja(C/W)
------------------------------------------------------------------------------------------------------------------------------------------
100
C70C
鈥�
23.3掳C/W
-------------------------------------
1.28 W
=
Table 2-5
Package Thermal Resistivities
Package Type
Device
Pin Count
jc
ja
Unit
Still Air
1 m/s
2.5 m/s
Quad Flat No Lead (QN)
AGL030
132
13.1
21.4
16.8
15.3
C/W
AGL060
132
11.0
21.2
16.6
15.0
C/W
AGL125
132
9.2
21.1
16.5
14.9
C/W
AGL250
132
8.9
21.0
16.4
14.8
C/W
AGL030
68
13.4
68.4
45.8
43.1
C/W
Very Thin Quad Flat Pack (VQ)*
100
10.0
35.3
29.4
27.1
C/W
Chip Scale Package (CS)
AGL1000
281
6.0
28.0
22.8
21.5
C/W
AGL400
196
7.2
37.1
31.1
28.9
C/W
AGL250
196
7.6
38.3
32.2
30.0
C/W
AGL125
196
8.0
39.5
33.4
31.1
C/W
AGL030
81
12.4
32.8
28.5
27.2
C/W
AGL060
81
11.1
28.8
24.8
23.5
C/W
AGL250
81
10.4
26.9
22.3
20.9
C/W
Micro Chip Scale Package (UC)
AGL030
81
16.9
40.6
35.2
33.7
C/W
Fine Pitch Ball Grid Array (FG)
AGL060
144
18.6
55.2
49.4
47.2
C/W
AGL1000
144
6.3
31.6
26.2
24.2
C/W
AGL400
144
6.8
37.6
31.2
29.0
C/W
AGL250
256
12.0
38.6
34.7
33.0
C/W
AGL1000
256
6.6
28.1
24.4
22.7
C/W
AGL1000
484
8.0
23.3
19.0
16.7
C/W
Note: *Thermal resistances for other device-package combinations will be posted in a later revision.
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