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參數(shù)資料
| 型號： | LZ1H331LS |
| 廠商： | DB Lectro Inc. |
| 英文描述： | CHIP TYPE, LOW IMPEDANCE |
| 中文描述： | 芯片類型，低阻抗 |
| 文件頁數(shù)： | 1/13頁 |
| 文件大?。?/td> | 423K |
| 代理商： | LZ1H331LS |
LZ
Series
Characteristics
Operation Temperature Range
-55 ~ +105
°
C
6.3 ~ 50V
±20% at 120Hz, 20
°
C
Rated Working Voltage
Capacitance Tolerance
I
d
0.01CV or 3
A whichever is greater (after 2 minutes)
I: Leakage current (
P
A) C: Normal
c
apacitance (
P
F)
Measurement frequency: 120Hz, Temperature: 20
°
C
WV
6.3
10
tan
0.
19
0.22
Leakage Current
V: Rated
v
oltage (V)
16
0.1
6
25
0.14
35
0.12
50
0.1
2
Dissipation Factor max.
Rated voltage (V)
6.3
2
5
10
2
4
16
2
4
25
2
3
35
2
3
50
2
3
Z(-25
°
C) / Z(20
°
C)
Z(-40
°
C) / Z(20
°
C)
Impedance ratio
ZT/Z20 (max
.
)
L
ow Temperature Characteristics
(Measurement frequency: 120Hz)
Capacitance Change
Within
r
2
0
% of initial value
200% or less of initial specified value
I
nitial specified value or less
Dissipation Factor
Leakage Current
Shelf Life
After leaving capacitors under no load at 105
°
C for 1000 hours, they meet the specified value
for load life characteristics listed above.
Capacitance Change
Dissipation Factor
Leakage Current
Within
r
10% of initial value
I
nitial specified value or less
I
nitial specified value or less
Resistance to Soldering Heat
Reference Standard
JIS C-5141 and JIS C-5102
D x L
A
B
C
E
L
4 x 5.
4
1.8
4.3
4.3
1.0
5.4
5 x 5.
4
2.1
5.3
5.3
1.3
5.4
6.3 x 5.
4
2.4
6.6
6.6
2.2
5.4
6.3 x 7.7
2.4
6.6
6.6
2.2
7.7
8 x 10.5
2.9
8.3
8.3
3.1
10.5
10 x 10.5
3.2
10.3
10.3
4.5
10.5
SPECIFICATIONS
DRAWING (Unit: mm)
DIMENSIONS (Unit: mm)
Negative
0.5~0.8
Plastic platefo
r
m
0.3max.
Positive
0
D
f
0
B
f
0
C
f
0.2
A
f
0
A
f
0
E
*
Voltage mark for 6.3V is [6V]
L
r
0.3
CHIP TYPE,
LOW IMPEDANCE
Low impedance
,
temperature range
up
to +105
q
C
Load life of 1000~2000 hours
Comply with the RoHS directive (2002/95/EC)
Item
s
Load Life
(After 2000 hours (1000 hours for
4,
5,
6.3x5.4) application of the rated
voltage at 105°C, capacitors meet the
characteristics requirements listed.)
After
reflow soldering according to Reflow Soldering Condition (see page 8) and restored at
room temperature,
they meet the
characteristics requirements listed as below.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| LZ1H331LT | CHIP TYPE, LOW IMPEDANCE |
| LZ1H331MC | CHIP TYPE, LOW IMPEDANCE |
| LZ1H331MR | CHIP TYPE, LOW IMPEDANCE |
| LZ1J010MR | CHIP TYPE, LOW IMPEDANCE |
| LZ1J010MS | CHIP TYPE, LOW IMPEDANCE |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LZ1H331LT | 制造商:DBLECTRO 制造商全稱:DB Lectro Inc 功能描述:CHIP TYPE, LOW IMPEDANCE |
| LZ1H331MC | 制造商:DBLECTRO 制造商全稱:DB Lectro Inc 功能描述:CHIP TYPE, LOW IMPEDANCE |
| LZ1H331MR | 制造商:DBLECTRO 制造商全稱:DB Lectro Inc 功能描述:CHIP TYPE, LOW IMPEDANCE |
| LZ1H331MS | 制造商:DBLECTRO 制造商全稱:DB Lectro Inc 功能描述:CHIP TYPE, LOW IMPEDANCE |
| LZ1H331MT | 制造商:DBLECTRO 制造商全稱:DB Lectro Inc 功能描述:CHIP TYPE, LOW IMPEDANCE |
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