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參數(shù)資料
| 型號(hào)： | LX8630-XX |
| 廠商： | Microsemi Corporation |
| 元件分類(lèi)： | 基準(zhǔn)電壓源/電流源 |
| 英文描述： | Cap-Free, NMOS, 150mA Low Dropout Regulator with Reverse Current Protection |
| 中文描述： | 無(wú)電容，NMOS管，150mA的低壓差穩(wěn)壓器的反向電流保護(hù) |
| 文件頁(yè)數(shù)： | 2/9頁(yè) |
| 文件大?。?/td> | 135K |
| 代理商： | LX8630-XX |
Microsemi
Linfinity Microelectronics Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
Copyright
2000
Rev. 1.0a,2000-11-28
W
M
.
LX8630-xx
3A BiCMOS Very Low Dropout Regulators
P
RODUCTION
D
ATA
S
HEET
A M I C R O S E M I C O M P A N Y
Input Voltage (V
IN
) ......................................................................................................6.5V
SHDN Pin..............................................................................................-0.3V to V
IN
+0.3V
Operating Junction Temperature
Plastic (P & DD Packages)................................................................................... 150
°
C
Storage Temperature Range........................................................................-65
°
C to 150
°
C
Lead Temperature (Soldering, 10 seconds)............................................................... 300
°
C
Note:
Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal.
P
P
LASTIC
TO-220 3-P
IN
THERMAL RESISTANCE
-
JUNCTION TO
T
AB
,
θ
JT
THERMAL RESISTANCE
-
JUNCTION TO AMBIENT
,
θ
JA
P
P
LASTIC
TO-220 5-P
IN
THERMAL RESISTANCE
-
JUNCTION TO
T
AB
,
θ
JT
THERMAL RESISTANCE
-
JUNCTION TO AMBIENT
,
θ
JA
DD
P
LASTIC
TO-263 3-P
IN
THERMAL RESISTANCE
-
JUNCTION TO
T
AB
,
θ
JT
THERMAL RESISTANCE
-
JUNCTION TO AMBIENT
,
θ
JA
DD
P
LASTIC
TO-263 5-P
IN
THERMAL RESISTANCE
-
JUNCTION TO
T
AB
,
θ
JT
THERMAL RESISTANCE
-
JUNCTION TO AMBIENT
,
θ
JA
2.1
°
C/W
60
°
C/W
2.1
°
C/W
60
°
C/W
2.1
°
C/W
60
°
C/W
2.1
°
C/W
60
°
C/W
Junction Temperature Calculation: T
J
= T
A
+ (P
D
x
θ
JA
).
The
θ
JA
numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow.
θ
JA
can be improved with package soldered to 0.5IN
2
copper area over backside
ground plane or internal power plane
.
θ
JA
can vary from 20°C/W to > 40°C/W
depending on mounting technique. See table below for thermal resistance
guidelines
:
Copper Area
(Topside)*
Copper Area
(Backside)*
2.5 sq” (1613mm
2
)
2.5 sq” (1613mm
2
)
2.5 sq” (1613mm
2
)
Board Area
Thermal
Resistance
(
θ
JA
)
25°C/W
27°C/W
35°C/W
2.5 sq” (1613mm
2
)
1.0 sq” (645 mm
2
)
0.17 sq” (110 mm
2
)
*Tab of device attached to topside copper
2.5 sq” (1613mm
2
)
2.5 sq” (1613mm
2
)
2.5 sq” (1613mm
2
)
DD P
ACKAGE
(3-
PIN
)
(Top View)
1
V
IN
GND
V
OUT
2
3
TAB is GND
DD P
ACKAGE
(5-P
IN
)
(Top View)
1
V
IN
GND
V
OUT
2
3
TAB is GND
4
5
ADJ
SHDN
P P
ACKAGE
(5-P
IN
)
(Top View)
1
2
3
TAB is GND
4
5
GND
V
OUT
ADJ
SHDN
V
IN
P P
ACKAGE
(3-P
IN
)
(Top View)
1
2
3
TAB is GND
GND
V
OUT
V
IN
P
A
C
K
A
G
E
D
A
T
A
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