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參數(shù)資料
| 型號： | LX1910CDU |
| 廠商： | MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | Step-Down Regulator |
| 中文描述： | 1 A SWITCHING REGULATOR, 1200 kHz SWITCHING FREQ-MAX, PDSO8 |
| 封裝： | LEAD FREE, PLASTIC, MSOP-8 |
| 文件頁數(shù)： | 2/8頁 |
| 文件大小： | 239K |
| 代理商： | LX1910CDU |
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
Copyright
2004
Rev. 1.1, 2005-02-25
W
M
.
C
LX1910
Step-Down Regulator
P
RODUCTION
D
ATA
S
HEET
TM
A B S O L U T E M A X I M U M R A T I N G S
Input Voltage (IN) or
SHDN
to GND.............................................................................-0.3V to 7.0V
SW to GND.............................................................................................................-0.3V to (V
IN
+ 0.3V)
V
FB
to GND..........................................................................................................................-0.3V to +2V
SW Peak Current (Internally Limited).......................................................................................1000mA
Operating Temperature Range.......................................................................................-40
°
C to +125
°
C
Storage Temperature Range, T
A
......................................................................................-65
°
C to 150
°
C
Maximum Junction Temperature....................................................................................................150
°
C
RoHS / Pb-free Peak Package Solder Reflow Temperature
(40 seconds maximum exposure)......................................................................................260
°
C (+0, -5)
Note
: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal
.
T H E R M A L D A T A
DU
Plastic MSOP 8-Pin
THERMAL RESISTANCE
-
JUNCTION TO
A
MBIENT
,
θ
JA
206
°
C/W
Junction Temperature Calculation: T
J
= T
A
+ (P
D
x
θ
JA
).
The
θ
JA
numbers are guidelines for the thermal
performance of the device/pc-board system. All of the above assume no ambient airflow.
P A C K A G E P IN O U T
SW
PGND
AGND
FB
PVIN
AVIN
SHDN
COMP
1
2
3
4
5
6
7
8
DU
P
ACKAGE
(Top View)
RoHS / Pb-free 100% Matte Tin Lead Finish
F U N C T I O N A L P I N D E S C R I P T I O N
N
AME
D
ESCRIPTION
SW
Inductor and commutation diode connection point. Connects to internal MOSFET drain.
AGND
Analog circuit ground providing bias for IC operation.
FB
Feedback input for setting adjustable output voltage
SHDN
Enable control input. Reduces quiescent current to 1
μ
A. Pin 8, Output becomes high impedance.
PVIN
Unregulated supply voltage input connected to PMOS Source. Input range from +2.7V to 6.0V
COMP
Frequency Compensation of the overall loop is effected by placing a series R/C combination between COMP pin and GND.
AVIN
Unregulated supply voltage input. Input range from +4V to 6.0V
PGND
Power ground (return path for internal PMOS gate driver).
P
A
C
K
A
G
E
D
A
T
A
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