參數(shù)資料
型號(hào)： LX1744CLQ
廠商： MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP
元件分類： 顯示驅(qū)動(dòng)器
英文描述： Dual Output Boost ? LED Driver / LCD Bias
中文描述： LED DISPLAY DRIVER, QCC16
封裝： PLASTIC, MLP-16
文件頁(yè)數(shù)： 2/16頁(yè)
文件大?。?/td> 571K
代理商： LX1744CLQ
LX1744
P
RODUCTION
D
ATASHEET
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
W
M
.
C
Dual Output Boost – LED Driver / LCD Bias
I N T E G R A T E D P R O D U C T S
Copyright
2000
Rev. 1.1b, 2005-03-01
A B S O L U T E M A X I M U M R A T I N G S
Supply Input Voltage...........................................................................-0.3V to 7V
Feedback Input Voltage (V
FB
, V
LFB
).......................................-0.3V to V
IN
+ 0.3V
Shutdown Input Voltage (V
SHDN
, V
LSHDN
))...........................-0.3V to V
IN
+ 0.3V
PWM Input Amplitude (ADJ, BRT).......................................-0.3V to V
IN
+ 0.3V
Analog Adjust Input Voltage (V
ADJ
, V
BRT
).............................-0.3V to V
IN
+ 0.3V
SRC Input Current................................................................................800mA
RMS
Operating Temperature Range.........................................................-40
°
C to 85
°
C
Maximum Operating Junction Temperature................................................ 150
°
C
Storage Temperature Range...........................................................-65
°
C to 150
°
C
RoHS Peak Package Solder Reflow Temperature
(40 second maximum exposure).....................................................260°C (+0, -5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal
.
T H E R M A L D A T A
LQ
Plastic MLPQ 16-Pin
THERMAL RESISTANCE
-
JUNCTION TO
A
MBIENT
,
θ
JA
31
°
C/W
PW
Plastic TSSOP 14-Pin
THERMAL RESISTANCE
-
JUNCTION TO
A
MBIENT
,
θ
JA
90
°
C/W
Junction Temperature Calculation: T
J
= T
A
+ (P
D
x
θ
JA
).
The
θ
JA
numbers are guidelines for the thermal performance of the device/pc-board system. All of the
above assume no ambient airflow.
P A C K A G E P I N O U T
LSHDN
REF
IN
FB
ADJ
CS
OVP
LFB
SW
DRV
SRC
BRT
GND
1
2
3
4
6
7
5
9
8
11
10
14
13
12
SHDN
PW
P
ACKAGE
(Top View)
G
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
SW
SHDN1
FB
ADJ
R
I
L
B
LFB
OVP
CS
DRV
S
G
N
LQ
P
ACKAGE
(Bottom View)
(“N.C.” = No Internal Connection)
RoHS / Pb-free 100% Matte Tin Lead Finish
P
A
C
K
A
G
E
D
A
T
A
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