參數(shù)資料
型號(hào): LX1732
廠商: Microsemi Corporation
英文描述: High Current PFM Boost Converter
中文描述: 烤瓷高電流升壓轉(zhuǎn)換器
文件頁(yè)數(shù): 2/12頁(yè)
文件大?。?/td> 322K
代理商: LX1732
Microsemi
Integrated Products
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
Copyright
2000
Rev. 1.1c, 2005-03-03
W
M
.
C
LX1732
High Current PFM Boost Converter
P
RODUCTION
D
ATA
S
HEET
I N T E G R A T E D P R O D U C T S
A B S O L U T E M A X I M U M R A T I N G S
Supply Voltage (V
IN
)........................................................................-0.3V to 7.0V
Output Voltage (V
C
) .........................................................................-0.3V to 7.0V
Switch Voltage (V
SW
) .......................................................................-0.3V to 7.0V
Shutdown Input Voltage (V
SHDN
).........................................-0.3V to (V
C
+ 0.3V)
Low Battery Detect Output (V
LBO
) ......................................
-0.3V to (V
C
+ 0.3V)
Low Battery Detect Input Voltage (V
LBI
) ..............................-0.3V to (V
C
+ 0.3V)
Feedback Input Voltage (V
FB
) ...............................................-0.3V to (V
C
+ 0.3V)
Switch Current (I
LX
).................................................................................. 1.0A
RMS
Operating Temperature Range............................................................0
°
C to 70
°
C
Operating Junction Temperature.................................................................. 150
°
C
Storage Temperature Range...........................................................-65
°
C to 150
°
C
Peak Package Temp for Solder Reflow (40 second max. exposure).............260°C (+0, -5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal
.
T H E R M A L D A T A
DU
Plastic MSOP 8-Pin
THERMAL RESISTANCE
-
JUNCTION TO
A
MBIENT
,
θ
JA
THERMAL RESISTANCE
-
JUNCTION TO
C
ASE
,
θ
JC
206
°
C/W
39
°
C/W
Junction Temperature Calculation: T
J
= T
A
+ (P
D
x
θ
JC
).
The
θ
JA
numbers are guidelines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow.
P A C K A G E P IN O U T
1
2
4
3
5
6
8
7
SW
LBI
VIN
VC
GND
FB
LBO
SHDN
DU
P
ACKAGE
(Top View)
RoHS / Pb-free 100% Matte Tin Lead Finish
F U N C T I O N A L P I N D E S C R I P T I O N
N
AME
D
ES CRIPT ION
IN
Unregulated IC Supply Voltage Input – Input range from +1.1V to 5.5V. Bypass with a 4.7
μ
F or greater capacitor.
Control pin for output voltage programming. Connect this pin to a resistive divider network between the output
and GND to obtain an output voltage between 2.0V and 5.5V.
Active-Low Shutdown Input – A logic low shuts down the device and reduces the supply current to 0.1
μ
A.
Connect
SHDN
to V
CC
for normal operation.
Inductor Switching Connection – Internally connected to the drain of an N-channel MOSFET.
Output voltage control pin: Connect this pin to the circuit load and cathode of the switching diode.
Common terminal for ground reference.
Low Battery Detect Comparator Input – Connect to a resistive divider network between the V
CC
and GND to set
the Low Battery Detect trip point. The LBI threshold is 0.6V.
Low Battery Detect Comparator Output – Open drain comparator output. This output is pulled low when V
LBI
is
less than 0.6V. LBO is high impedance during shutdown.
FB
SHDN
SW
VC
GND
LBI
LBO
P
A
C
K
A
G
E
D
A
T
A
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