
P
R O G R A M M A B L E
R
E F E R E N C E
LX1431
P R O D U C T D A T A B O O K 1 9 9 6 / 1 9 9 7
Copyright 1997
Rev. 1.2 4/97
2
P
R O D U C T I O N
D
A T A
S
H E E T
ABSOLUTE MAXIMUM RATINGS
(Note 1)
V
+
, V
................................................................................................................. 36V
V
, R
, R
, V
...................................................................................................... 6V
GND-F to GND-S ........................................................................................................ 0.7V
Operating Junction Temperature
Plastic (M, DM Packages) ..................................................................................... 150°C
Storage Temperature Range ...................................................................... -65°C to 150°C
Lead Temperature ..................................................................................................... 300°C
PACKAGE PIN OUTS
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect
to Ground. Currents are positive into, negative out of the specified terminal.
M PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
DM PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
95°C/W
165°C/W
Junction Temperature Calculation: T
= T
+ (P
x
θ
).
The
θ
numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow.
THERMAL DATA
M PACKAGE
(Top View)
BLOCK DIAGRAM
gm=
60μA/V
REF
R
MID
R
TOP
V
+
COMP
COLLECTOR
GND-SENSE
GND-FORCE
6
5
8
7
4
3
2
1
5K
5K
2.5V
DM PACKAGE
(Top View)
REF
R
MID
GND-F
GND-S
COLLECTOR
COMP
V
+
R
TOP
1
8
2
7
3
6
4
5
1
8
2
7
3
6
4
5
REF
R
MID
GND-F
GND-S
COLLECTOR
COMP
V
+
R
TOP