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參數(shù)資料
| 型號： | LV8746V |
| 廠商： | SANYO SEMICONDUCTOR CO LTD |
| 元件分類： | 運動控制電子 |
| 英文描述： | STEPPER MOTOR CONTROLLER, 1.2 A, PDSO44 |
| 封裝： | 0.275 INCH, SSOP-44 |
| 文件頁數(shù)： | 19/24頁 |
| 文件大?。?/td> | 400K |
| 代理商： | LV8746V |
LV8746V
0
1.0
2.0
2.20
4.0
3.0
3.10
1.61
1.14
—
20
40
60
80
20
0
100
Two-layer circuit board 1 *1
Two-layer circuit board 2 *2
*1 With components mounted on the exposed die-pad board
*2 With no components mounted on the exposed die-pad board
Substrate Specifications (Substrate recommended for operation of LV8746V)
Size
: 90mm × 90mm × 1.6mm (two-layer substrate [2S0P])
Material
: Glass epoxy
Copper wiring density : L1 = 85% / L2 = 90%
L1 : Copper wiring pattern diagram
L2 : Copper wiring pattern diagram
Cautions
1) The data for the case with the Exposed Die-Pad substrate mounted shows the values when 90% or more of the
Exposed Die-Pad is wet.
2) For the set design, employ the derating design with sufficient margin.
Stresses to be derated include the voltage, current, junction temperature, power loss, and mechanical stresses such as
vibration, impact, and tension.
Accordingly, the design must ensure these stresses to be as low or small as possible.
The guideline for ordinary derating is shown below :
(1)Maximum value 80% or less for the voltage rating
(2)Maximum value 80% or less for the current rating
(3)Maximum value 80% or less for the temperature rating
3) After the set design, be sure to verify the design with the actual product.
Confirm the solder joint state and verify also the reliability of solder joint for the Exposed Die-Pad, etc.
Any void or deterioration, if observed in the solder joint of these parts, causes deteriorated thermal conduction,
possibly resulting in thermal destruction of IC.
No.A1563-4/24
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