參數(shù)資料
型號： LTM4612MPV#PBF
廠商： LINEAR TECHNOLOGY CORP
元件分類： 穩(wěn)壓器
英文描述： SWITCHING CONTROLLER, 940 kHz SWITCHING FREQ-MAX, PBGA133
封裝： 15 X 15 MM, 2.82 MM HEIGHT, LEAD FREE, MO-222, LGA-133
文件頁數(shù)： 10/26頁
文件大?。?/td> 5123K
代理商： LTM4612MPV#PBF
LTM4612
4612fa
applicaTions inForMaTion
Safety Considerations
The LTM4612 modules do not provide isolation from VIN
to VOUT. There is no internal fuse. If required, a slow blow
fuse with a rating twice the maximum input current needs
to be provided to protect each unit from catastrophic
failure.
Layout Checklist/Example
The high integration of LTM4612 makes the PCB board
layout very simple and easy. However, to optimize its
electrical and thermal performance, some layout consid-
erations are still necessary.
Use large PCB copper areas for high current path, in-
cluding VIN, PGND and VOUT. It helps to minimize the
PCB conduction loss and thermal stress.
Place high frequency ceramic input and output capaci-
tors next to the VD, PGND and VOUT pins to minimize
high frequency noise.
Place a dedicated power ground layer underneath the
unit.
Use round corners for the PCB copper layer to minimize
the radiated noise.
To minimize the EMI noise and reduce module thermal
stress, use multiple vias for interconnection between
top layer and other power layers.
Do not put vias directly on pads.
If vias are placed onto the pads, the the vias must be
capped.
Interstitial via placement can also be used if necessary.
Use a separated SGND ground copper area for com-
ponents connected to signal pins. Connect the SGND
to PGND underneath the unit.
Place one or more high frequency ceramic capacitors
close to the connection into the system board.
Figure 17 gives a good example of the recommended
layout.
Table 4. 5V Output
DERATING CURVE
VIN (V)
POWER LOSS CURVE
AIR FLOW (LFM)
HEAT SINK
θJA (°C/W)
Figures 18, 21
36
Figure 10
0
None
14.9
Figures 18, 21
36
Figure 10
200
None
11.1
Figures 18, 21
36
Figure 10
400
None
10
Figures 10, 13, 16
36
Figure 10
0
BGA Heat Sink
14
Figures 10, 13, 16
36
Figure 10
200
BGA Heat Sink
10.4
Figures 10, 13, 16
36
Figure 10
400
BGA Heat Sink
9.3
Heat Sink Manufacturer
Wakefield Engineering
Part No: LTN20069
Phone: 603-635-2800
Figure 17. Recommended PCB Layout
SIGNAL
GND
VOUT
VIN
GND
COUT
CIN
COUT
4612 F17
相關(guān)PDF資料
PDF描述
LTM4612IV#PBF SWITCHING CONTROLLER, 940 kHz SWITCHING FREQ-MAX, PBGA133
LTS15D10C-01 SPECIALTY ANALOG CIRCUIT, XSS
LTS15A10C-01 SPECIALTY ANALOG CIRCUIT, XSS
LU59002 INFRARED, RECEIVER IC, PDIP20
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
LTM4612V 制造商:LINER 制造商全稱:Linear Technology 功能描述:Ultralow Noise 36VIN, 15VOUT, 5A, DC/DC μModule
LTM4613 制造商:LINER 制造商全稱:Linear Technology 功能描述:符合 EN55022B 規(guī)格的36VIN、15VOUT、8A、DC/DC μModule 穩(wěn)壓器,LTM®4613 是一款完整、超低噪聲、8A 開關(guān)模式 DC/DC電源。
LTM4613EV#PBF 功能描述:IC DC/DC UMODULE 8A 133-LGA RoHS:是 類別:電源 - 板載 >> DC DC Converters 系列:µModule® 設(shè)計資源:VI-200, VI-J00 Design Guide, Appl Manual 標(biāo)準(zhǔn)包裝:1 系列:* 類型:隔離 輸出數(shù):1 電壓 - 輸入（最小）:66V 電壓 - 輸入（最大）:160V Voltage - Output 1:12V Voltage - Output 2:- Voltage - Output 3:- 電流 - 輸出（最大）:* 電源（瓦） - 制造商系列:50W 電壓 - 隔離:* 特點:* 安裝類型:通孔 封裝/外殼:9-FinMod 尺寸/尺寸:4.60" L x 1.86" W x 0.79" H（116.8mm x 47.2mm x 20.1mm） 包裝:散裝 工作溫度:-25°C ~ 85°C 效率:* 電源（瓦特）- 最大:*
LTM4613EVPBF 制造商:Linear Technology 功能描述:DC/DC Regulator EN55022B 8A 36V Low EMI
LTM4613IV#PBF 功能描述:IC UMODULE DC/DC 8A 133-LGA RoHS:是 類別:電源 - 板載 >> DC DC Converters 系列:µModule® 設(shè)計資源:VI-200, VI-J00 Design Guide, Appl Manual 標(biāo)準(zhǔn)包裝:1 系列:* 類型:隔離 輸出數(shù):1 電壓 - 輸入（最小）:18V 電壓 - 輸入（最大）:36V Voltage - Output 1:5.8V Voltage - Output 2:- Voltage - Output 3:- 電流 - 輸出（最大）:* 電源（瓦） - 制造商系列:75W 電壓 - 隔離:* 特點:* 安裝類型:通孔 封裝/外殼:9 針法蘭半磚電源模塊 尺寸/尺寸:2.28" L x 2.40" W x 0.50" H（57.9mm x 61.0mm x 12.7mm） 包裝:散裝 工作溫度:-10°C ~ 100°C 效率:* 電源（瓦特）- 最大:*
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