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參數(shù)資料
| 型號： | LTC6406IMS8E#TRPBF |
| 廠商： | Linear Technology |
| 文件頁數(shù)： | 16/24頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC AMP/DRIVER DIFF 8-MSOP |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 類型： | ADC 驅(qū)動器 |
| 應(yīng)用： | 數(shù)據(jù)采集 |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-TSSOP，8-MSOP（0.118"，3.00mm 寬）裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 8-MSOP-EP |
| 包裝： | 帶卷 (TR) |
LTC6406
23
6406fc
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
MS8E Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1662)
MSOP (MS8E) 0307 REV D
0.53
± 0.152
(.021
± .006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.86
(.034)
REF
0.65
(.0256)
BSC
0
° – 6° TYP
DETAIL “A”
GAUGE PLANE
12
3
4
4.90
± 0.152
(.193
± .006)
8
1
BOTTOM VIEW OF
EXPOSED PAD OPTION
7 6 5
3.00
± 0.102
(.118
± .004)
(NOTE 3)
3.00
± 0.102
(.118
± .004)
(NOTE 4)
0.52
(.0205)
REF
1.83
± 0.102
(.072
± .004)
2.06
± 0.102
(.081
± .004)
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
2.083
± 0.102
(.082
± .004)
2.794
± 0.102
(.110
± .004)
0.889
± 0.127
(.035
± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.42
± 0.038
(.0165
± .0015)
TYP
0.65
(.0256)
BSC
0.1016
± 0.0508
(.004
± .002)
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