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參數(shù)資料
| 型號： | LTC6360IDD#TRPBF |
| 廠商： | LINEAR TECHNOLOGY CORP |
| 元件分類： | 模擬信號調(diào)理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, PDSO8 |
| 封裝： | 3 X 3 MM, LEAD FREE, PLASTIC, M0-229WEED-1, DFN-8 |
| 文件頁數(shù)： | 16/24頁 |
| 文件大?。?/td> | 514K |
| 代理商： | LTC6360IDD#TRPBF |
LTC6360
23
6360f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However,noresponsibilityisassumedforitsuse.LinearTechnologyCorporationmakesnorepresenta-
tionthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.
package DescripTion
MS8E Package
8-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1662 Rev I)
MSOP (MS8E) 0910 REV I
0.53
± 0.152
(.021
± .006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD
SHALL NOT EXCEED 0.254mm (.010") PER SIDE.
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.86
(.034)
REF
0.65
(.0256)
BSC
0
° – 6° TYP
DETAIL “A”
GAUGE PLANE
1 2 3 4
4.90
± 0.152
(.193
± .006)
8
1
BOTTOM VIEW OF
EXPOSED PAD OPTION
7 6 5
3.00
± 0.102
(.118
± .004)
(NOTE 3)
3.00
± 0.102
(.118
± .004)
(NOTE 4)
0.52
(.0205)
REF
1.68
(.066)
1.88
(.074)
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
1.68
± 0.102
(.066
± .004)
1.88
± 0.102
(.074
± .004)
0.889
± 0.127
(.035
± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.65
(.0256)
BSC
0.42
± 0.038
(.0165
± .0015)
TYP
0.1016
± 0.0508
(.004
± .002)
DETAIL “B”
CORNER TAIL IS PART OF
THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
0.05 REF
0.29
REF
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