參數(shù)資料
型號: LTC4309IGN#TRPBF
廠商: Linear Technology
文件頁數(shù): 15/16頁
文件大?。?/td> 200K
描述: IC BUS BUFFER 2-WIRE 16-SSOP
產(chǎn)品培訓(xùn)模塊: LTC4310 - Hot-Swappable I²C Isolators
標(biāo)準(zhǔn)包裝: 2,500
類型: 熱交換開關(guān)
應(yīng)用: 通用型緩沖器/總線擴(kuò)展器
內(nèi)部開關(guān):
電源電壓: 2.3 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-SSOP(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 16-SSOP
包裝: 帶卷 (TR)
LTC4309
15
4309fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However,
no responsibility is assumed for its use. Linear Technology Corporation makes no representation that
the interconnection of its circuits as described herein will not infringe on existing patent rights.
GN16 (SSOP) 0204
1   2   3   4   5   6   7   8
.229  .244
(5.817  6.198)
  .150  .157**
(3.810  3.988)
16  15 14  13
  .189  .196*
(4.801  4.978)
12  11 10 9
.016  .050
(0.406  1.270)
 .015 .004
(0.38 0.10)
 45
0  8 TYP
.007  .0098
(0.178  0.249)
.0532  .0688
(1.35  1.75)
.008  .012
(0.203  0.305)
TYP
.004  .0098
(0.102  0.249)
.0250
(0.635)
BSC
.009
(0.229)
REF
.254 MIN
RECOMMENDED SOLDER PAD LAYOUT
.150  .165
.0250 BSC
.0165 .0015
.045 .005
INCHES
(MILLIMETERS)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
  * DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
  SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
  FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
4.00 0.10
(2 SIDES)
3.00 0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
   (WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
0.40 0.10
BOTTOM VIEWEXPOSED PAD
1.70 0.05
(2 SIDES)
0.75 0.05
R = 0.115
TYP
R = 0.05
TYP
0.25 0.05
3.30 0.05
(2 SIDES)
1
6
12
7
0.50
BSC
PIN 1 NOTCH
R = 0.20 OR
0.35 45
CHAMFER
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00  0.05
(UE12/DE12) DFN 0905 REV C
0.25 0.05
3.30 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.70 0.05
(2 SIDES)
2.20 0.05
0.50
BSC
0.70 0.05
3.60 0.05
PACKAGE OUTLINE
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD
   FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
  ON THE TOP AND BOTTOM OF PACKAGE
DE/UE Package
12-Lead Plastic DFN (4mm x 3mm)
(Reference LTC DWG # 05-08-1695)
 PACKAGE DESCRIPTION
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