Please refer to http://www.linear.com/designtools/packaging/
參數(shù)資料
型號(hào)： LTC4278IDKD#TRPBF
廠商： Linear Technology
文件頁數(shù)： 35/42頁
文件大?。?/td> 0K
描述： IC PD IEEE 802.3AT 25.5W 32-DFN
標(biāo)準(zhǔn)包裝： 2,500
控制器類型： 供電設(shè)備接口控制器（PD）
接口： IEEE 802.3af
電源電壓： 4.5 V ~ 20 V
電流 - 電源： 6.4mA
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 32-WFDFN 裸露焊盤
供應(yīng)商設(shè)備封裝： 32-DFN（7x4）裸露焊盤
包裝： 帶卷 (TR)
LTC4278
40
4278fc
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WXXX)
IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
PIN 1
TOP MARK
(SEE NOTE 6)
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
0.20 ±0.05 1
16
17
32
6.00 REF
6.43 ±0.10
2.65 ±0.10
4.00 ±0.10
0.75 ±0.05
0.00 – 0.05
0.200 REF
7.00 ±0.10
(DKD32) QFN 0707 REV A
0.40 BSC
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1 NOTCH
R = 0.30 TYP OR
0.35
× 45° CHAMFER
6.43 ±0.05
2.65 ±0.05
0.70 ±0.05
0.40 BSC
6.00 REF
3.10 ±0.05
4.50 ±0.05
0.40 ±0.10
0.20 ±0.05
PACKAGE
OUTLINE
R = 0.05
TYP
DKD Package
32-Lead Plastic DFN (7mm
× 4mm)
(Reference LTC DWG # 05-08-1734 Rev A)
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WXXX)
IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
PIN 1
TOP MARK
(SEE NOTE 6)
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
0.20 ±0.05 1
16
17
32
6.00 REF
6.43 ±0.10
2.65 ±0.10
4.00 ±0.10
0.75 ±0.05
0.00 – 0.05
0.200 REF
7.00 ±0.10
(DKD32) QFN 0707 REV A
0.40 BSC
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1 NOTCH
R = 0.30 TYP OR
0.35
× 45° CHAMFER
6.43 ±0.05
2.65 ±0.05
0.70 ±0.05
0.40 BSC
6.00 REF
3.10 ±0.05
4.50 ±0.05
0.40 ±0.10
0.20 ±0.05
PACKAGE
OUTLINE
R = 0.05
TYP
DKD Package
32-Lead Plastic DFN (7mm
× 4mm)
(Reference LTC DWG # 05-08-1734 Rev A)
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