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參數(shù)資料
| 型號： | LTC4227CUFD-2#TRPBF |
| 廠商： | LINEAR TECHNOLOGY CORP |
| 元件分類： | 電源管理 |
| 英文描述： | POWER SUPPLY MANAGEMENT CKT, PQCC20 |
| 封裝： | 4 X 5 MM, PLASTIC, MO-220, QFN-20 |
| 文件頁數(shù)： | 11/20頁 |
| 文件大?。?/td> | 307K |
| 代理商： | LTC4227CUFD-2#TRPBF |
LTC4227-1/LTC4227-2
19
422712f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
package DescripTion
UFD Package
20-Lead Plastic QFN (4mm
× 5mm)
(Reference LTC DWG # 05-08-1711 Rev B)
4.00
± 0.10
(2 SIDES)
1.50 REF
5.00
± 0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40
± 0.10
19
20
1
2
BOTTOM VIEW—EXPOSED PAD
2.50 REF
0.75
± 0.05
R = 0.115
TYP
PIN 1 NOTCH
R = 0.20 OR
C = 0.35
0.25
± 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UFD20) QFN 0506 REV B
R = 0.05 TYP
2.65
± 0.10
3.65
± 0.10
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70
±0.05
0.25
±0.05
2.65
± 0.05
2.50 REF
4.10
± 0.05
5.50
± 0.05
1.50 REF
3.10
± 0.05
4.50
± 0.05
PACKAGE
OUTLINE
3.65
± 0.05
0.50 BSC
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
GN16 (SSOP) 0204
1 2 3 4 5 6 7 8
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
16 15 14 13
.189 – .196*
(4.801 – 4.978)
12 11 10 9
.016 – .050
(0.406 – 1.270)
.015
± .004
(0.38
± 0.10)
× 45°
0
° – 8° TYP
.007 – .0098
(0.178 – 0.249)
.0532 – .0688
(1.35 – 1.75)
.008 – .012
(0.203 – 0.305)
TYP
.004 – .0098
(0.102 – 0.249)
.0250
(0.635)
BSC
.009
(0.229)
REF
.254 MIN
RECOMMENDED SOLDER PAD LAYOUT
.150 – .165
.0250 BSC
.0165
±.0015
.045
±.005
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
INCHES
(MILLIMETERS)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
相關PDF資料 |
PDF描述 |
|---|---|
| LTC4227IGN-1#TRPBF | POWER SUPPLY MANAGEMENT CKT, PDSO16 |
| LTC4227CUFD-1#PBF | POWER SUPPLY MANAGEMENT CKT, PQCC20 |
| LTC4227IUFD-2#PBF | POWER SUPPLY MANAGEMENT CKT, PQCC20 |
| LTC4227CUFD-2#PBF | POWER SUPPLY MANAGEMENT CKT, PQCC20 |
| LTC4227IGN-2#TRPBF | POWER SUPPLY MANAGEMENT CKT, PDSO16 |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
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| LTC4227CUFD-3#TRPBF | 制造商:Linear Technology 功能描述:IC CTRLR HOT SWAP 20QFN 制造商:Linear Technology 功能描述:DIODE-OR/HOT SWAP CTRL, 18V, QFN-20, IC Function:Diode-OR and Hot Swap Controlle |
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| LTC4227CUFD-4#TRPBF | 制造商:Linear Technology 功能描述:IC CTRLR HOT SWAP 20QFN 制造商:Linear Technology 功能描述:DIODE-OR/HOT SWAP CTRL, 18V, QFN-20, IC Function:Diode-OR and Hot Swap Controlle |
| LTC4227IGN-1#PBF | 功能描述:IC CONTROLLER HOT SWAP 16-SSOP RoHS:是 類別:集成電路 (IC) >> PMIC - 熱交換 系列:- 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:119 系列:- 類型:熱交換控制器 應用:通用型，PCI Express? 內(nèi)部開關:無 電流限制:- 電源電壓:3.3V，12V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:80-TQFP 供應商設備封裝:80-TQFP（12x12） 包裝:托盤 產(chǎn)品目錄頁面:1423 (CN2011-ZH PDF) |
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