參數(shù)資料
型號： LTC4213CDDB#TRMPBF
廠商： Linear Technology
文件頁數(shù)： 11/20頁
文件大小： 0K
描述： IC CIRC BREAK ELEC 8-DFN
標(biāo)準(zhǔn)包裝： 500
系列： *
類型： *
應(yīng)用： *
安裝類型： 表面貼裝
封裝/外殼： 8-WFDFN 裸露焊盤
供應(yīng)商設(shè)備封裝： 8-DFN（3x2）
包裝： 帶卷 (TR)
LTC4213
19
4213f
PACKAGE DESCRIPTIO
U
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
2.00 ±0.10
(2 SIDES)
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
0.38 ± 0.10
BOTTOM VIEW—EXPOSED PAD
0.56 ± 0.05
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
2.15 ±0.05
(2 SIDES)
3.00 ±0.10
(2 SIDES)
1
4
8
5
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
0 – 0.05
(DDB8) DFN 1103
0.25 ± 0.05
2.20 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.61 ±0.05
(2 SIDES)
1.15 ±0.05
0.675 ±0.05
2.50 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
PIN 1
CHAMFER OF
EXPOSED PAD
0.50 BSC
DDB Package
8-Lead Plastic DFN (3mm × 2mm)
(Reference LTC DWG # 05-08-1702)
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