參數(shù)資料
型號(hào)： LTC3588EDD-1#TRPBF
廠商： LINEAR TECHNOLOGY CORP
元件分類： 穩(wěn)壓器
英文描述： SWITCHING REGULATOR, PDSO10
封裝： 3 X 3 MM, LEAD FREE, PLASTIC, MO-229WEED-2, DFN-10
文件頁(yè)數(shù)： 15/20頁(yè)
文件大?。?/td> 391K
代理商： LTC3588EDD-1#TRPBF
LTC3588-1
4
35881fa
TYPICAL PERFORMANCE CHARACTERISTICS
IVIN in UVLO vs VIN
IVIN in Sleep vs VIN
UVLO Rising vs Temperature
UVLO Falling vs Temperature
VSHUNT vs Temperature
Total Bridge Rectier Drop
vs Bridge Current
TEMPERATURE (°C)
–55
UVLO
RISING
(V)
5.2
5.0
4.6
4.2
4.8
4.4
4.0
3.8
25
105
–15
65
35881 G03
125
585
–35
45
D1 = D0 = 1
D1 = D0 = 0
TEMPERATURE (°C)
–55
UVLO
F
ALLING
(V)
4.2
4.0
3.6
3.2
3.8
3.4
3.0
2.8
25
105
–15
65
35881 G04
125
585
–35
45
D1 = D0 = 1
D1 = D0 = 0
D1 = 1, D0 = 0
BRIDGE CURRENT (A)
V
BRIDGE
(mV)
35881 G06
1800
1600
1400
1200
1000
800
600
400
200
0
1μ
10μ
10m
1m
100μ
85°C
25°C
–40°C
|VPZ1 – VPZ2| – VIN
VIN (V)
0
I VIN
(nA)
1000
900
700
500
800
600
400
300
200
100
0
45
2
35881 G01
6
3
1
D1 = D0 = 1
85°C
25°C
–40°C
VIN (V)
2
I VIN
(nA)
2400
2200
1800
1400
2000
1600
1200
1000
800
600
400
14
810
16
35881 G02
18
12
6
4
D1 = D0 = 0
85°C
25°C
–40°C
TEMPERATURE (°C)
–55
V
SHUNT
(V)
21.0
20.8
20.4
20.0
20.6
20.2
19.6
19.8
19.4
19.2
19.0
65
5
25
85 105
35881 G05
125
45
–15
–35
ISHUNT = 25mA
ISHUNT = 1mA
ELECTRICAL CHARACTERISTICS
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC3588-1 is tested under pulsed load conditions such
that TJ ≈ TA. The LTC3588E-1 is guaranteed to meet specications
from 0°C to 85°C junction temperature. Specications over the –40°C
to 125°C operating junction temperature range are assured by design,
characterization, and correlation with statistical process controls.
The LTC3588I-1 is guaranteed over the full –40°C to 125°C operating
junction temperature range. Note that the maximum ambient temperature
consistent with these specications is determined by specic operating
conditions in conjunction with board layout, the rated package thermal
impedance and other environmental factors.
Note 3: The junction temperature (TJ, in °C) is calculated from the ambient
temperature (TA, in °C) and power dissipation (PD, in Watts) according
to the formula: TJ = TA + (PD θJA), where θJA (in °C/W) is the package
thermal impedance.
Note 4: Dynamic supply current is higher due to gate charge being
delivered at the switching frequency.
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