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參數(shù)資料
| 型號： | LTC3496IUFD#TRPBF |
| 廠商： | LINEAR TECHNOLOGY CORP |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | SWITCHING CONTROLLER, 2300 kHz SWITCHING FREQ-MAX, PQCC28 |
| 封裝： | 4 X 5 MM, LEAD FREE, PLASTIC, MO-220, QFN-28 |
| 文件頁數(shù)： | 2/16頁 |
| 文件大小： | 296K |
| 代理商： | LTC3496IUFD#TRPBF |
LT3496
10
3496f
APPLICATIONS INFORMATION
The CTRL pins should not be left open. The CTRL pin
can also be used in conjunction with a PTC thermistor to
provide overtemperature protection for the LED load as
shown in Figure 2.
Board Layout
The high speed operation of the LT3496 demands careful
attention to board layout and component placement. The
Exposed Pad of the package is the only GND terminal of
the IC and is important for thermal management of the
IC. Therefore, it is crucial to achieve a good electrical
and thermal contact between the Exposed Pad and the
ground plane of the board. Also, in boost conguration,
the Schottky rectier and the capacitor between GND and
the cathode of the Schottky are in the high frequency
switching path where current ow is discontinuous. These
elements should be placed so as to minimize the path
between SW and the GND of the IC. To reduce electro-
magnetic interference (EMI), it is important to minimize
the area of the SW node. Use the GND plane under SW to
minimize interplane coupling to sensitive signals. To obtain
good current regulation accuracy and eliminate sources
of channel to channel coupling, the CAP and LED inputs
of each channel of the LT3496 should be run as separate
lines back to the terminals of the sense resistor. Any
resistance in series with CAP and LED inputs should be
minimized. Finally, the bypass capacitor on the VIN supply
to the LT3496 should be placed as close as possible to
the VIN terminal of the device.
50k
3496 F02
45k
2V
VREF
5k
PTC
CTRL1-3
Figure 2
Thermal Considerations
The LT3496 is rated to a maximum input voltage of 30V
for continuous operation, and 40V for nonrepetitive one
second transients. Careful attention must be paid to the
internal power dissipation of the LT3496 at higher input
voltages to ensure that a junction temperature of 125°C
is not exceeded. This is especially important when operat-
ing at high ambient temperatures. The Exposed Pad on
the bottom of the package must be soldered to a ground
plane. This ground should then be connected to an internal
copper ground plane with thermal vias placed directly
under the package to spread out the heat dissipated by
the LT3496.
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