參數(shù)資料
型號: LTC3113EFE#PBF
廠商: LINEAR TECHNOLOGY CORP
元件分類: 穩(wěn)壓器
英文描述: 16 A SWITCHING REGULATOR, 2000 kHz SWITCHING FREQ-MAX, PDSO20
封裝: 4.40 MM, LEAD FREE, PLASTIC, TSSOP-20
文件頁數(shù): 6/24頁
文件大?。?/td> 383K
代理商: LTC3113EFE#PBF
LTC3113
14
3113f
APPLICATIONS INFORMATION
The capacitors listed in Table 2 provide a sampling of small
surface mount ceramic capacitors that are well suited to
LTC3113 application circuits. All listed capacitors are either
X5R or X7R dielectric in order to ensure that capacitance
loss over temperature is minimized.
Table 2. Representative Buck-Boost Surface Input Mount Bypass
and Output Capacitors
PART NUMBER
VALUE
(μF)
VOLTAGE
(V)
SIZE (mm) W
× L × H
(FOOTPRINT)
AVX (www.avx.com)
1812D476KAT2A
47
6.3
3.2
× 4.5 × 2.5 (1812)
18126D107KAT2A
100
6.3
3.2
× 4.5 × 2.8 (1812)
Murata (www.murata.com)
GRM43ER60J476ME01
47
6.3
3.2
× 4.5 × 2.5 (1812)
GRM43SR60J107ME20
100
6.3
3.2
× 4.5 × 2.8 (1812)
GRM55FR60J107KA01L
100
6.3
5
× 5.7 × 3.2 (2220)
Taiyo Yuden (www.t-yuden.com)
JMK432BJ476MM-T
47
6.3
3.2
× 4.5 × 2.5 (1812)
JMK432C107MM-T
100
6.3
3.2
× 4.5 × 2.8 (1812)
TDK (www.component.tdk.com)
C4532X5R0J476M
47
6.3
3.2
× 4.5 × 2.5 (1812)
C4532X5R0J107M
100
6.3
3.2
× 4.5 × 2.5 (1812)
C5750X5R1C476M
47
16
5
× 5.7 × 2.5 (2220)
C5750X5R1A686M
68
10
5
× 5.7 × 2.5 (2220)
C5750X5R0J107M
100
6.3
5
× 5.7 × 2.5 (2220)
PCB LAYOUT CONSIDERATIONS
The LTC3113 switches large currents at high frequencies.
Special attention should be paid to the PCB layout to ensure
a stable, noise-free and efcient application circuit. Figure
3 presents a representative 4-layer PCB layout to outline
some of the primary considerations. A few key guidelines
are outlined below:
1. All circulating high current paths should be kept as
short as possible. This can be accomplished by keeping
the routes to all highlighted components in Figure 3
as short and as wide as possible. Capacitor ground
connections should via down to the ground plane in
the shortest route possible. The bypass capacitors on
VIN should be placed as close to the IC as possible and
should have the shortest possible paths to ground.
2. The Exposed Pad is the power ground connection for
the LTC3113. Multiple vias should connect the backpad
directly to the ground plane. In addition maximization
of the metallization connected to the backpad will im-
prove the thermal environment and improve the power
handling capabilities of the IC. Refer to Figure 3d bot-
tom layer as an example of proper exposed pad power
ground and via layout to provide good thermal and
ground connection performance.
3. The components shown highlighted and their connec-
tions should all be placed over a complete ground plane
to minimize loop cross-sectional areas. This minimizes
EMI and reduces inductive drops.
4. Connections to all of the components shown highlighted
should be made as wide as possible to reduce the series
resistance. This will improve efciency and maximize the
output current capability of the buck-boost converter.
5. To prevent large circulating currents from disrupting
the output voltage sensing, the ground for each resistor
divider should be returned to the ground plane using
a via placed close to the IC and away from the power
connections.
6. Keep the connection from the resistor dividers to the
feedback pins, FB, as short as possible and away from
the switch pin connections.
7. Crossover connections should be made on inner copper
layers if available. If it is necessary to place these on
the ground plane, make the trace on the ground plane
as short as possible to minimize the disruption to the
ground plane.
Thermal Considerations
The LTC3113 output current may need to be derated if
it is required to operate in a high ambient temperature
or delivering a large amount of continuous power. The
amount of current derating is dependent upon the input
voltage, output voltage and ambient temperature. The
temperature rise curves given in the Typical Performance
Characteristics section can be used as a guide. These curves
were generated by mounting the LTC3113 to a 4-layer
FR4 demo board shown in Figure 3. Boards of other sizes
and layer count can exhibit different thermal behavior, so
相關(guān)PDF資料
PDF描述
LTC3113IDHD#TRPBF 16 A SWITCHING REGULATOR, 2000 kHz SWITCHING FREQ-MAX, PDSO16
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參數(shù)描述
LTC3113IDHD#PBF 功能描述:IC REG BUCK BOOST ADJ 3A 16DFN RoHS:是 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - DC DC 開關(guān)穩(wěn)壓器 系列:- 設(shè)計資源:Design Support Tool 標準包裝:1 系列:- 類型:升壓(升壓) 輸出類型:固定 輸出數(shù):1 輸出電壓:3V 輸入電壓:0.75 V ~ 2 V PWM 型:- 頻率 - 開關(guān):- 電流 - 輸出:100mA 同步整流器:是 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:SOT-23-5 細型,TSOT-23-5 包裝:剪切帶 (CT) 供應(yīng)商設(shè)備封裝:TSOT-23-5 其它名稱:AS1323-BTTT-30CT
LTC3113IDHD#TRPBF 功能描述:IC REG BUCK BOOST ADJ 3A 16DFN RoHS:是 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - DC DC 開關(guān)穩(wěn)壓器 系列:- 設(shè)計資源:Design Support Tool 標準包裝:1 系列:- 類型:升壓(升壓) 輸出類型:固定 輸出數(shù):1 輸出電壓:3V 輸入電壓:0.75 V ~ 2 V PWM 型:- 頻率 - 開關(guān):- 電流 - 輸出:100mA 同步整流器:是 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:SOT-23-5 細型,TSOT-23-5 包裝:剪切帶 (CT) 供應(yīng)商設(shè)備封裝:TSOT-23-5 其它名稱:AS1323-BTTT-30CT
LTC3113IFE#PBF 功能描述:IC REG BUCK BOOST ADJ 3A 20TSSOP RoHS:是 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - DC DC 開關(guān)穩(wěn)壓器 系列:- 設(shè)計資源:Design Support Tool 標準包裝:1 系列:- 類型:升壓(升壓) 輸出類型:固定 輸出數(shù):1 輸出電壓:3V 輸入電壓:0.75 V ~ 2 V PWM 型:- 頻率 - 開關(guān):- 電流 - 輸出:100mA 同步整流器:是 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:SOT-23-5 細型,TSOT-23-5 包裝:剪切帶 (CT) 供應(yīng)商設(shè)備封裝:TSOT-23-5 其它名稱:AS1323-BTTT-30CT
LTC3113IFE#TRPBF 功能描述:IC REG BUCK BOOST ADJ 3A 20TSSOP RoHS:是 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - DC DC 開關(guān)穩(wěn)壓器 系列:- 設(shè)計資源:Design Support Tool 標準包裝:1 系列:- 類型:升壓(升壓) 輸出類型:固定 輸出數(shù):1 輸出電壓:3V 輸入電壓:0.75 V ~ 2 V PWM 型:- 頻率 - 開關(guān):- 電流 - 輸出:100mA 同步整流器:是 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:SOT-23-5 細型,TSOT-23-5 包裝:剪切帶 (CT) 供應(yīng)商設(shè)備封裝:TSOT-23-5 其它名稱:AS1323-BTTT-30CT
LTC3115-1 制造商:LINEAR 制造商全稱:LINEAR 功能描述:40V, 2A Synchronous Buck-Boost DC/DC Converter