參數(shù)資料
型號: LTC2369IMS-18#TRPBF
廠商: Linear Technology
文件頁數(shù): 15/24頁
文件大?。?/td> 0K
描述: IC ADC 18BIT SRL/SPI 16-MSOP
產(chǎn)品培訓模塊: LTC2369- 18-/16-bit Pseudo-Differential SAR ADC Family Overview
標準包裝: 2,500
位數(shù): 18
采樣率(每秒): 1.6M
數(shù)據(jù)接口: 串行,SPI?
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 21.5mW
電壓電源: 模擬和數(shù)字
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-TFSOP(0.118",3.00mm 寬)
供應商設備封裝: 16-MSOP
包裝: 帶卷 (TR)
輸入數(shù)目和類型: 1 個偽差分,單極
配用: DC1813A-E-ND - BOARD SAR ADC LTC2369-18
LTC2369-18
22
236918fa
3.00 ±0.10
(2 SIDES)
4.00 ±0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
0.75 ±0.05
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
1.70 ± 0.05
3.15 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.20 ±0.05
0.70 ±0.05
3.60 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
3.30 ±0.05
0.45 BSC
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.70 ± 0.10
R = 0.115
TYP
R = 0.05
TYP
3.15 REF
1
8
16
9
(DE16) DFN 0806 REV
PIN 1 NOTCH
R = 0.20 OR
0.35
× 45°
CHAMFER
3.30 ±0.10
0.23 ± 0.05
0.45 BSC
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
DE Package
16-Lead Plastic DFN (4mm
× 3mm)
(Reference LTC DWG # 05-08-1732 Rev )
MS Package
16-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1669 Rev )
MSOP (MS16) 1107 REV
0.53
± 0.152
(.021
± .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 –0.27
(.007 – .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
16151413121110
1234567 8
9
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
0.254
(.010)
0
° – 6° TYP
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
± 0.127
(.035
± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.305
± 0.038
(.0120
± .0015)
TYP
0.50
(.0197)
BSC
4.039
± 0.102
(.159
± .004)
(NOTE 3)
0.1016
± 0.0508
(.004
± .002)
3.00
± 0.102
(.118
± .004)
(NOTE 4)
0.280
± 0.076
(.011
± .003)
REF
4.90
± 0.152
(.193
± .006)
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
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