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參數(shù)資料
| 型號： | LTC2266IUJ-14#TRPBF |
| 廠商： | Linear Technology |
| 文件頁數(shù)： | 20/32頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC ADC 14BIT 80MSPS DUAL 40QFN |
| 標準包裝： | 2,000 |
| 位數(shù)： | 14 |
| 采樣率（每秒）： | 80M |
| 數(shù)據(jù)接口： | Serial LVDS |
| 轉(zhuǎn)換器數(shù)目： | 2 |
| 功率耗散（最大）： | 257mW |
| 電壓電源： | 單電源 |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 40-WFQFN 裸露焊盤 |
| 供應商設(shè)備封裝： | 40-QFN（6x6） |
| 包裝： | 帶卷 (TR) |
| 輸入數(shù)目和類型： | 2 Differential; 2 Single-Ended |
| 配用： | DC1371A-ND - BOARD USB DATA ACQUISITION HS |
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LTC2268-14/
LTC2267-14/LTC2266-14
27
22687614fa
applicaTions inForMaTion
GROUNDING AND BYPASSING
The LTC2268-14/LTC2267-14/LTC2266-14 requires a
printed circuit board with a clean unbroken ground plane.
A multilayer board with an internal ground plane in the
first layer beneath the ADC is recommended. Layout for
the printed circuit board should ensure that digital and
analog signal lines are separated as much as possible. In
particular, care should be taken not to run any digital track
alongside an analog signal track or underneath the ADC.
High quality ceramic bypass capacitors should be used at
the VDD, OVDD, VCM, VREF, REFH and REFL pins. Bypass
capacitorsmustbelocatedasclosetothepinsaspossible.
Of particular importance is the 0.1F capacitor between
REFH and REFL. This capacitor should be on the same
side of the circuit board as the A/D, and as close to the
device as possible (1.5mm or less). Size 0402 ceramic
capacitors are recommended. The larger 2.2F capacitor
between REFH and REFL can be somewhat further away.
Thetracesconnectingthepinsandbypasscapacitorsmust
be kept short and should be made as wide as possible.
The analog inputs, encode signals, and digital outputs
should not be routed next to each other. Ground fill and
grounded vias should be used as barriers to isolate these
signals from each other.
HEAT TRANSFER
MostoftheheatgeneratedbytheLTC2268-14/LTC2267-14/
LTC2266-14 is transferred from the die through the
bottom-side Exposed Pad and package leads onto the
printed circuit board. For good electrical and thermal
performance, the Exposed Pad must be soldered to a large
grounded pad on the PC board. This pad should be con-
nected to the internal ground planes by an array of vias.
Typical applicaTions
Silkscreen Top
Top Side
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LTC2267-12 | 制造商:LINER 制造商全稱:Linear Technology 功能描述:16-Bit, 20Msps Low Power ADC |
| LTC2267-14 | 制造商:LINER 制造商全稱:Linear Technology 功能描述:16-Bit, 65Msps/40Msps/25Msps Low Power Dual ADCs |
| LTC2267CUJ-12#PBF | 功能描述:IC ADC 12BIT SER 105MSPS 40-QFN RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 系列:- 其它有關(guān)文件:TSA1204 View All Specifications 標準包裝:1 系列:- 位數(shù):12 采樣率（每秒）:20M 數(shù)據(jù)接口:并聯(lián) 轉(zhuǎn)換器數(shù)目:2 功率耗散（最大）:155mW 電壓電源:模擬和數(shù)字 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:48-TQFP 供應商設(shè)備封裝:48-TQFP（7x7） 包裝:Digi-Reel® 輸入數(shù)目和類型:4 個單端，單極；2 個差分，單極 產(chǎn)品目錄頁面:1156 (CN2011-ZH PDF) 其它名稱:497-5435-6 |
| LTC2267CUJ-12#TRPBF | 功能描述:IC ADC 12BIT 105MSPS DUAL 40QFN RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 系列:- 標準包裝:1 系列:- 位數(shù):14 采樣率（每秒）:83k 數(shù)據(jù)接口:串行，并聯(lián) 轉(zhuǎn)換器數(shù)目:1 功率耗散（最大）:95mW 電壓電源:雙 ± 工作溫度:0°C ~ 70°C 安裝類型:通孔 封裝/外殼:28-DIP（0.600"，15.24mm） 供應商設(shè)備封裝:28-PDIP 包裝:管件 輸入數(shù)目和類型:1 個單端，雙極 |
| LTC2267CUJ-12PBF | 制造商:LINER 制造商全稱:Linear Technology 功能描述:12-Bit, 125Msps/105Msps/ 80Msps Low Power Dual ADCs |
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