AIN+ (Pins 1, 2): Positive Differential Analog I" />
參數(shù)資料
型號(hào)： LTC2230CUP#PBF
廠商： Linear Technology
文件頁(yè)數(shù)： 4/32頁(yè)
文件大小： 0K
描述： IC ADC 10BIT 170MSPS 64-QFN
標(biāo)準(zhǔn)包裝： 40
位數(shù)： 10
采樣率（每秒）： 170M
數(shù)據(jù)接口： 并聯(lián)
轉(zhuǎn)換器數(shù)目： 1
功率耗散（最大）： 1.18W
電壓電源： 單電源
工作溫度： 0°C ~ 70°C
安裝類型： 表面貼裝
封裝/外殼： 64-WFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝： 64-QFN（9x9）
包裝： 管件
輸入數(shù)目和類型： 1 個(gè)單端，雙極; 1 個(gè)差分，雙極
LTC2230/LTC2231
12
22301fb
(CMOS Mode)
AIN+ (Pins 1, 2): Positive Differential Analog Input.
AIN– (Pins 3, 4): Negative Differential Analog Input.
REFHA (Pins 5, 6): ADC High Reference. Bypass to
Pins 7, 8 with 0.1
μF ceramic chip capacitor, to Pins 11, 12
with a 2.2
μF ceramic capacitor and to ground with 1μF
ceramic capacitor.
REFLB (Pins 7, 8): ADC Low Reference. Bypass to Pins 5,
6 with 0.1
μF ceramic chip capacitor. Do not connect to
Pins 11, 12.
REFHB (Pins 9, 10): ADC High Reference. Bypass to
Pins 11, 12 with 0.1
μF ceramic chip capacitor. Do not
connect to Pins 5, 6.
REFLA (Pins 11, 12): ADC Low Reference. Bypass to
Pins 9, 10 with 0.1
μF ceramic chip capacitor, to Pins 5, 6
with a 2.2
μF ceramic capacitor and to ground with 1μF
ceramic capacitor.
VDD (Pins 13, 14, 15, 62, 63): 3.3V Supply. Bypass to
GND with 0.1
μF ceramic chip capacitors.
GND (Pins 16, 61, 64): ADC Power Ground.
ENC+ (Pin 17): Encode Input. The input sample starts on
the positive edge.
ENC– (Pin 18): Encode Complement Input. Conversion
starts on the negative edge. Bypass to ground with 0.1
μF
ceramic for single-ended ENCODE signal.
SHDN (Pin 19): Shutdown Mode Selection Pin. Connect-
ing SHDN to GND and OE to GND results in normal
operation with the outputs enabled. Connecting SHDN to
GND and OE to VDD results in normal operation with the
outputs at high impedance. Connecting SHDN to VDD and
OE to GND results in nap mode with the outputs at high
impedance. Connecting SHDN to VDD and OE to VDD
results in sleep mode with the outputs at high impedance.
OE (Pin 20): Output Enable Pin. Refer to SHDN pin
function.
DNC (Pins 21, 22, 40, 43): Do not connect these pins.
DB0 - DB9 (Pins 23, 24, 27, 28, 29, 30, 31, 32, 35, 36):
Digital Outputs, B bus. At high impedance in full rate
CMOS mode. DB9 is MSB.
OGND (Pins 25, 33, 41, 50): Output Driver Ground.
OVDD (Pins 26, 34, 42, 49): Positive Supply for the Output
Drivers. Bypass to ground with 0.1
μF ceramic chip
capacitor.
OFB (Pin 37): Over/Under Flow Output for B bus. High
when an over or under flow has occurred. At high imped-
ance in full rate CMOS mode.
CLKOUTB (Pin 38): Data Valid Output for B bus. In demux
mode with interleaved update, latch B bus data on the
falling edge of CLKOUTB. In demux mode with simulta-
neous update, latch B bus data on the rising edge of
CLKOUTB. This pin does not become high impedance in
full rate CMOS mode.
CLKOUTA (Pin 39): Data Valid Output for A bus. Latch A
bus data on the falling edge of CLKOUTA.
DA0 - DA9 (Pins 44 to 48, 51 to 55): Digital Outputs, A bus.
DA9 is the MSB.
OFA (Pin 56): Over/Under Flow Output for A bus. High
when an over or under flow has occurred.
LVDS (Pin 57): Output Mode Selection Pin. Connecting
LVDS to 0V selects full rate CMOS mode. Connecting
LVDS to 1/3VDD selects demux CMOS mode with simulta-
neous update. Connecting LVDS to 2/3VDD selects demux
CMOS mode with interleaved update. Connecting LVDS to
VDD selects LVDS mode.
UU
U
PI FU CTIO S
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