參數(shù)資料
型號(hào)： LTC1663CS5#TR
廠商： Linear Technology
文件頁數(shù)： 3/12頁
文件大?。?/td> 0K
描述： IC DAC 10BIT R-R TSOT23-5
標(biāo)準(zhǔn)包裝： 2,500
設(shè)置時(shí)間： 30µs
位數(shù)： 10
數(shù)據(jù)接口： 串行
轉(zhuǎn)換器數(shù)目： 1
電壓電源： 單電源
功率耗散（最大）： 630µW
工作溫度： 0°C ~ 70°C
安裝類型： 表面貼裝
封裝/外殼： SOT-23-5 細(xì)型，TSOT-23-5
供應(yīng)商設(shè)備封裝： TSOT-23-5
包裝： 帶卷 (TR)
輸出數(shù)目和類型： 1 電壓，單極
采樣率（每秒）： *
LTC1663
11
1663fd
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
S5 Package
5-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1635)
PACKAGE DESCRIPTION
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
1.50 – 1.75
(NOTE 4)
2.80 BSC
0.30 – 0.45 TYP
5 PLCS (NOTE 3)
DATUM ‘A’
0.09 – 0.20
(NOTE 3)
S5 TSOT-23 0302
PIN ONE
2.90 BSC
(NOTE 4)
0.95 BSC
1.90 BSC
0.80 – 0.90
1.00 MAX
0.01 – 0.10
0.20 BSC
0.30 – 0.50 REF
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
3.85 MAX
0.62
MAX
0.95
REF
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
1.4 MIN
2.62 REF
1.22 REF
MSOP (MS8) 0204
0.53 ± 0.152
(.021 ± .006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.127 ± 0.076
(.005 ± .003)
0.86
(.034)
REF
0.65
(.0256)
BSC
0° – 6° TYP
DETAIL “A”
GAUGE PLANE
12 3 4
4.90 ± 0.152
(.193 ± .006)
8 7 6 5
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 ± 0.127
(.035 ± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.42 ± 0.038
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC
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