參數(shù)資料
型號(hào): LTC1662IN8#PBF
廠商: Linear Technology
文件頁(yè)數(shù): 5/16頁(yè)
文件大?。?/td> 0K
描述: IC D/A CONV 10BIT MICRPWR 8-DIP
標(biāo)準(zhǔn)包裝: 50
設(shè)置時(shí)間: 400µs
位數(shù): 10
數(shù)據(jù)接口: 串行
轉(zhuǎn)換器數(shù)目: 2
電壓電源: 單電源
功率耗散(最大): 260µW
工作溫度: -40°C ~ 85°C
安裝類型: 通孔
封裝/外殼: 8-DIP(0.300",7.62mm)
供應(yīng)商設(shè)備封裝: 8-PDIP
包裝: 管件
輸出數(shù)目和類型: 2 電壓,單極
采樣率(每秒): *
LTC1662
13
1662fa
package Description
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F)
MSOP (MS8) 0307 REV F
0.53
± 0.152
(.021
± .006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.1016
± 0.0508
(.004
± .002)
0.86
(.034)
REF
0.65
(.0256)
BSC
0
° – 6° TYP
DETAIL “A”
GAUGE PLANE
1 2 3 4
4.90
± 0.152
(.193
± .006)
8 7 6 5
3.00
± 0.102
(.118
± .004)
(NOTE 3)
3.00
± 0.102
(.118
± .004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
± 0.127
(.035
± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.42
± 0.038
(.0165
± .0015)
TYP
0.65
(.0256)
BSC
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
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