參數(shù)資料
型號： LTC1542CMS8
廠商： Linear Technology
文件頁數(shù)： 3/12頁
文件大?。?/td> 0K
描述： IC OPAMP/COMP/REF MICRPWR 8MSOP
標準包裝： 50
類型： 放大器，比較器，參考
應用： GSM
安裝類型： 表面貼裝
封裝/外殼： 8-TSSOP，8-MSOP（0.118"，3.00mm 寬）
供應商設備封裝： 8-MSOP
包裝： 管件
11
LTC1541/LTC1542
15412fd
3.00
±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
0.38
± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65
± 0.10
(2 SIDES)
0.75
±0.05
R = 0.115
TYP
2.38
±0.10
(2 SIDES)
1
4
8
5
PIN 1
TOP MARK
0.200 REF
0.00 – 0.05
(DD8) DFN 0203
0.28
± 0.05
2.38
±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65
±0.05
(2 SIDES)
2.15
±0.05
0.50
BSC
0.675
±0.05
3.5
±0.05
PACKAGE
OUTLINE
0.28
± 0.05
0.50 BSC
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
U
PACKAGE DESCRIPTIO
DD Package
8-Lead Plastic DFN (3mm
× 3mm)
(Reference LTC DWG # 05-08-1698)
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
.016 – .050
(0.406 – 1.270)
.010 – .020
(0.254 – 0.508)
× 45°
0
°– 8° TYP
.008 – .010
(0.203 – 0.254)
SO8 0303
.053 – .069
(1.346 – 1.752)
.014 – .019
(0.355 – 0.483)
TYP
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
1
2
3
4
.150 – .157
(3.810 – 3.988)
NOTE 3
8
7
6
5
.189 – .197
(4.801 – 5.004)
NOTE 3
.228 – .244
(5.791 – 6.197)
.245
MIN
.160
±.005
RECOMMENDED SOLDER PAD LAYOUT
.045
±.005
.050 BSC
.030
±.005
TYP
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
MSOP (MS8) 0204
0.53
± 0.152
(.021
± .006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.127
± 0.076
(.005
± .003)
0.86
(.034)
REF
0.65
(.0256)
BSC
0
° – 6° TYP
DETAIL “A”
GAUGE PLANE
12
3
4
4.90
± 0.152
(.193
± .006)
8
7 6 5
3.00
± 0.102
(.118
± .004)
(NOTE 3)
3.00
± 0.102
(.118
± .004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
± 0.127
(.035
± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.42
± 0.038
(.0165
± .0015)
TYP
0.65
(.0256)
BSC
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參數(shù)描述
LTC1542CMS8#PBF 功能描述:IC OPAMP/COMP/REF MICRPWR 8MSOP RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:- 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:60 系列:- 類型:可變增益放大器 應用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤 供應商設備封裝:20-TQFN-EP（5x5） 包裝:托盤
LTC1542CMS8#TR 功能描述:IC OPAMP/COMP/REF MICROPWR 8MSOP RoHS:否 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:- 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:60 系列:- 類型:可變增益放大器 應用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤 供應商設備封裝:20-TQFN-EP（5x5） 包裝:托盤
LTC1542CMS8#TRPBF 功能描述:IC OPAMP/COMP/REF MICRPWR 8MSOP RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:- 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:60 系列:- 類型:可變增益放大器 應用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤 供應商設備封裝:20-TQFN-EP（5x5） 包裝:托盤
LTC1542CS8 制造商:Linear Technology 功能描述:OP Amp and Comparator 8-Pin SOIC N 制造商:Linear Technology 功能描述:P OpAmp + Comparator
LTC1542CS8#PBF 功能描述:IC OPAMP/COMP/REF MICRPWR 8SOIC RoHS:是 類別:集成電路 (IC) >> 線性 - 放大器 - 專用 系列:- 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:60 系列:- 類型:可變增益放大器 應用:CATV 安裝類型:表面貼裝 封裝/外殼:20-WQFN 裸露焊盤 供應商設備封裝:20-TQFN-EP（5x5） 包裝:托盤
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