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參數(shù)資料
| 型號(hào)： | LT6600CS8#TR |
| 廠商： | LINEAR TECHNOLOGY CORP |
| 元件分類： | 模擬信號(hào)調(diào)理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, PDSO8 |
| 封裝： | 0.150 INCH, PLASTIC, SOP-8 |
| 文件頁(yè)數(shù)： | 4/16頁(yè) |
| 文件大小： | 211K |
| 代理商： | LT6600CS8#TR |
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LT6600-10
12
66001fd
APPLICATIONS INFORMATION
Power Dissipation
The LT6600-10 ampliers combine high speed with
large-signal currents in a small package. There is a need
to ensure that the dies’s junction temperature does not
exceed 150°C. The LT6600-10 S8 package has Pin 6 fused
to the lead frame to enhance thermal conduction when
connecting to a ground plane or a large metal trace. Metal
trace and plated through-holes can be used to spread the
heat generated by the device to the backside of the PC
board. For example, on a 3/32" FR-4 board with 2oz copper,
a total of 660 square millimeters connected to Pin 6 of
the LT6600-10 S8 (330 square millimeters on each side
of the PC board) will result in a thermal resistance,
θJA,of
about 85°C/W. Without the extra metal trace connected to
the V– pin to provide a heat sink, the thermal resistance
will be around 105°C/W. Table 2 can be used as a guide
when considering thermal resistance.
Table 2. LT6600-10 SO-8 Package Thermal Resistance
COPPER AREA
TOPSIDE
(mm2)
BACKSIDE
(mm2)
BOARD AREA
(mm2)
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
1100
2500
65°C/W
330
2500
85°C/W
35
2500
95°C/W
35
0
2500
100°C/W
0
2500
105°C/W
Junction temperature, TJ, is calculated from the ambient
temperature, TA, and power dissipation, PD. The power
dissipation is the product of supply voltage, VS, and
supply current, IS. Therefore, the junction temperature
is given by:
TJ = TA + (PD θJA) = TA + (VS IS θJA)
where the supply current, IS,isafunctionofsignallevel,load
impedance, temperature and common mode voltages.
For a given supply voltage, the worst-case power
dissipation occurs when the differential input signal is
maximum, the common mode currents are maximum
(see the Applications Information section regarding
common mode DC currents), the load impedance is
small and the ambient temperature is maximum. To
compute the junction temperature, measure the supply
current under these worst-case conditions, estimate the
thermal resistance from Table 2, then apply the equation
for TJ. For example, using the circuit in Figure 3 with
DC differential input voltage of 250mV, a differential
output voltage of 1V, no load resistance and an ambient
temperature of 85°C, the supply current (current into V+)
measures 48.9mA. Assuming a PC board layout with a
35mm2 copper trace, the
θJA is 100°C/W. The resulting
junction temperature is:
TJ = TA + (PD θJA) = 85 + (5 0.0489 100) = 109°C
When using higher supply voltages or when driving small
impedances, more copper may be necessary to keep TJ
below 150°C.
Figure 8
FREQUENCY (MHz)
0.1
SPECTRAL
DENSIT
Y
(nV
RMS
/√Hz)
INTEGRA
TED
NOISE
(mV
RMS
)
35
30
25
20
15
10
5
0
140
120
100
80
60
40
20
0
1.0
10
100
6600 F08
SPECTRAL DENSITY
INTEGRATED
NOISE
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| LT6600IDF-10#PBF | 功能描述:IC AMP DIFF LN 12-DFN RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標(biāo)準(zhǔn)包裝:50 系列:- 放大器類型:J-FET 電路數(shù):2 輸出類型:- 轉(zhuǎn)換速率:3.5 V/µs 增益帶寬積:1MHz -3db帶寬:- 電流 - 輸入偏壓:30pA 電壓 - 輸入偏移:2000µV 電流 - 電源:200µA 電流 - 輸出 / 通道:- 電壓 - 電源，單路/雙路(±):7 V ~ 36 V，±3.5 V ~ 18 V 工作溫度:0°C ~ 70°C 安裝類型:通孔 封裝/外殼:8-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:8-PDIP 包裝:管件 |
| LT6600IDF-10#TRPBF | 功能描述:IC AMP DIFF LN 12-DFN RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標(biāo)準(zhǔn)包裝:73 系列:Over-The-Top® 放大器類型:通用 電路數(shù):4 輸出類型:滿擺幅 轉(zhuǎn)換速率:0.07 V/µs 增益帶寬積:200kHz -3db帶寬:- 電流 - 輸入偏壓:1nA 電壓 - 輸入偏移:285µV 電流 - 電源:50µA 電流 - 輸出 / 通道:25mA 電壓 - 電源，單路/雙路(±):2 V ~ 44 V，±1 V ~ 22 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-WFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:16-DFN-EP（5x3） 包裝:管件 |
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