參數(shù)資料
型號: LT3506IDHD
廠商: LINEAR TECHNOLOGY CORP
元件分類: 穩(wěn)壓器
英文描述: 3.6 A SWITCHING REGULATOR, 650 kHz SWITCHING FREQ-MAX, PDSO16
封裝: 5 X 4 MM, PLASTIC, MO-229WJGD-2, DFN-16
文件頁數(shù): 9/24頁
文件大?。?/td> 210K
代理商: LT3506IDHD
LT3506/LT3506A
17
3506afc
Shorted Input Protection
If the inductor is chosen so that it won’t saturate exces-
sively, the LT3506 will tolerate a shorted output. There is
another situation to consider in systems where the output
will be held high when the input to the LT3506 is absent.
If the VIN and one of the RUN/SS pins are allowed to oat,
then the LT3506’s internal circuitry will pull its quiescent
current through its SW pin. This is ne if your system can
tolerate a few mA of load in this state. With both RUN/SS
pins grounded, the LT3506 enters shutdown mode and
the SW pin current drops to ~30μA. However, if the VIN pin
is grounded while the output is held high, then parasitic
diodes inside the LT3506 can pull large currents from the
output through the SW pin and the VIN pin. A Schottky
diode in series with the input to the LT3506 will protect
the LT3506 and the system from a shorted or reversed
input, as shown in Figure 6.
PCB Layout
For proper operation and minimum EMI, care must be
taken during printed circuit board (PCB) layout. Figure 7
shows the high-di/dt paths in the buck regulator circuit.
Note that large, switched currents ow in the power switch,
the catch diode and the input capacitor. The loop formed by
these components should be as small as possible. These
components, along with the inductor and output capacitor,
should be placed on the same side of the circuit board,
and their connections should be made on that layer. Place
a local, unbroken ground plane below these components,
and tie this ground plane to system ground at one location,
ideally at the ground terminal of the output capacitor C2.
Additionally, the SW and BOOST nodes should be kept as
small as possible. Figure 8 shows recommended compo-
nent placement with trace and via locations.
Thermal Considerations
The PCB must also provide heat sinking to keep the LT3506
cool. The exposed metal on the bottom of the package
must be soldered to a ground plane. This ground should
be tied to other copper layers below with thermal vias;
these layers will spread the heat dissipated by the LT3506.
Place additional vias near the catch diodes. Adding more
copper to the top and bottom layers and tying this cop-
per to the internal planes with vias can reduce thermal
resistance further. With these steps, the thermal resis-
tance from die (or junction) to ambient can be reduced to
θJA = 43°C/W.
The power dissipation in the other power components—
catch diodes, boost diodes and inductors, cause additional
copper heating and can further increase what the IC sees
as ambient temperature. See the LT1767 data sheet’s
Thermal Considerations section.
VIA TO LOCAL GROUND PLANE
VIA TO VIN
PIN 1
TOP MARK
3506 F08
GND
VOUT1
VOUT2
Figure 8. A Good PCB Layout Ensures Proper Low EMI Operation
APPLICATIONS INFORMATION
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LT3506IDHD-PBF 制造商:LINER 制造商全稱:Linear Technology 功能描述:Dual Monolithic 1.6A Step-Down Switching Regulator
LT3506IDHD-TR 制造商:LINER 制造商全稱:Linear Technology 功能描述:Dual Monolithic 1.6A Step-Down Switching Regulator