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參數(shù)資料
| 型號(hào)： | LT3092MPST#TRPBF |
| 廠商： | LINEAR TECHNOLOGY CORP |
| 元件分類： | 模擬信號(hào)調(diào)理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, PDSO3 |
| 封裝： | LEAD FREE, PLASTIC, SOT-223, 4 PIN |
| 文件頁(yè)數(shù)： | 11/22頁(yè) |
| 文件大?。?/td> | 245K |
| 代理商： | LT3092MPST#TRPBF |
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LT3092
19
3092fb
DD Package
8-Lead Plastic DFN (3mm
× 3mm)
(Reference LTC DWG # 05-08-1698)
PACKAGE DESCRIPTION
ST Package
3-Lead Plastic SOT-223
(Reference LTC DWG # 05-08-1630)
3.00
±0.10
(4 SIDES)
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
0.38
± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65
± 0.10
(2 SIDES)
0.75
±0.05
R = 0.115
TYP
2.38
±0.10
(2 SIDES)
1
4
8
5
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN 1203
0.25
± 0.05
2.38
±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65
±0.05
(2 SIDES)
2.15
±0.05
0.50 BSC
0.675
±0.05
3.5
±0.05
PACKAGE
OUTLINE
0.25
± 0.05
0.50 BSC
.114 – .124
(2.90 – 3.15)
.248 – .264
(6.30 – 6.71)
.130 – .146
(3.30 – 3.71)
.264 – .287
(6.70 – 7.30)
.0905
(2.30)
BSC
.033 – .041
(0.84 – 1.04)
.181
(4.60)
BSC
.024 – .033
(0.60 – 0.84)
.071
(1.80)
MAX
10
MAX
.012
(0.31)
MIN
.0008 – .0040
(0.0203 – 0.1016)
10 – 16
.010 – .014
(0.25 – 0.36)
10 – 16
RECOMMENDED SOLDER PAD LAYOUT
ST3 (SOT-233) 0502
.129 MAX
.059 MAX
.181 MAX
.039 MAX
.248 BSC
.090
BSC
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