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    • 您現(xiàn)在的位置:買賣IC網(wǎng) > PDF目錄5781 > LT1795CSW#TR (Linear Technology)IC AMP CURR FEEDBACK DUAL 20SOIC PDF資料下載
    參數(shù)資料
    型號: LT1795CSW#TR
    廠商: Linear Technology
    文件頁數(shù): 12/12頁
    文件大小: 0K
    描述: IC AMP CURR FEEDBACK DUAL 20SOIC
    標準包裝: 1,000
    放大器類型: 電流反饋
    電路數(shù): 2
    轉(zhuǎn)換速率: 900 V/µs
    -3db帶寬: 65MHz
    電流 - 輸入偏壓: 10µA
    電壓 - 輸入偏移: 3000µV
    電流 - 電源: 29mA
    電流 - 輸出 / 通道: 1A
    電壓 - 電源,單路/雙路(±): ±5 V ~ 15 V
    工作溫度: 0°C ~ 70°C
    安裝類型: 表面貼裝
    封裝/外殼: 20-SOIC(0.295",7.50mm 寬)
    供應商設(shè)備封裝: 20-SO
    包裝: 帶卷 (TR)
    第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁當前第12頁
    9
    LT1795
    1795fa
    APPLICATIO S I FOR ATIO
    WU
    U
    ture until the device begins thermal shutdown gives a
    good indication of how much margin there is in the
    thermal design.
    For surface mount devices, heat sinking is accomplished
    by using the heat spreading capabilities of the PC board
    and its copper traces. For the TSSOP package, power is
    dissipated through the exposed heatsink. For the SO
    package, power is dissipated from the package primarily
    through the V – pins (4 to 7 and 14 to 17). These pins
    should have a good thermal connection to a copper plane,
    either by direct contact or by plated through holes. The
    copper plane may be an internal or external layer. The
    thermal resistance, junction-to-ambient will depend on
    the total copper area connected to the device. For example,
    the thermal resistance of the LT1795 connected to a 2
    × 2
    inch, double sided 2 oz copper plane is 40
    °C/W.
    CALCULATING JUNCTION TEMPERATURE
    The junction temperature can be calculated from the
    equation:
    TJ = (PD)(θJA) + TA
    where
    TJ = Junction Temperature
    TA = Ambient Temperature
    PD = Device Dissipation
    θJA = Thermal Resistance (Junction-to-Ambient)
    Differential Input Signal Swing
    The differential input swing is limited to about
    ±5V by an
    ESD protection device connected between the inputs. In
    normal operation, the differential voltage between the
    input pins is small, so this clamp has no effect. However,
    in the shutdown mode, the differential swing can be the
    same as the input swing. The clamp voltage will then set
    the maximum allowable input voltage.
    POWER SUPPLY BYPASSING
    To obtain the maximum output and the minimum distor-
    tion from the LT1795, the power supply rails should be
    well bypassed. For example, with the output stage supply-
    ing 0.5A current peaks into the load, a 1
    power supply
    impedance will cause a droop of 0.5V, reducing the
    available output swing by that amount. Surface mount
    tantalum and ceramic capacitors make excellent low ESR
    bypass elements when placed close to the chip. For
    frequencies above 100kHz, use 1
    F and 100nF ceramic
    capacitors. If significant power must be delivered below
    100kHz, capacitive reactance becomes the limiting factor.
    Larger ceramic or tantalum capacitors, such as 4.7
    F, are
    recommended in place of the 1
    F unit mentioned above.
    Inadequate bypassing is evidenced by reduced output
    swing and “distorted” clipping effects when the output is
    driven to the rails. If this is observed, check the supply pins
    of the device for ripple directly related to the output
    waveform. Significant supply modulation indicates poor
    bypassing.
    Capacitance on the Inverting Input
    Current feedback amplifiers require resistive feedback
    from the output to the inverting input for stable operation.
    Take care to minimize the stray capacitance between the
    output and the inverting input. Capacitance on the invert-
    ing input to ground will cause peaking in the frequency
    response (and overshoot in the transient response), but it
    does not degrade the stability of the amplifier.
    Feedback Resistor Selection
    The optimum value for the feedback resistors is a function
    of the operating conditions of the device, the load imped-
    ance and the desired flatness of response. The Typical AC
    Performance tables give the values which result in less
    than 1dB of peaking for various resistive loads and oper-
    ating conditions. If this level of flatness is not required, a
    higher bandwidth can be obtained by use of a lower
    feedback resistor.
    For resistive loads, the COMP pin should be left open (see
    Capacitive Loads section).
    Capacitive Loads
    The LT1795 includes an optional compensation network
    for driving capacitive loads. This network eliminates most
    of the output stage peaking associated with capacitive
    loads, allowing the frequency response to be flattened.
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    LT1795IFE 功能描述:IC AMP CURR FEEDBCK DUAL 20TSSOP RoHS:否 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標準包裝:150 系列:- 放大器類型:音頻 電路數(shù):2 輸出類型:- 轉(zhuǎn)換速率:5 V/µs 增益帶寬積:12MHz -3db帶寬:- 電流 - 輸入偏壓:100nA 電壓 - 輸入偏移:500µV 電流 - 電源:6mA 電流 - 輸出 / 通道:50mA 電壓 - 電源,單路/雙路(±):4 V ~ 32 V,±2 V ~ 16 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP(0.173",4.40mm 寬) 供應商設(shè)備封裝:8-TSSOP 包裝:管件
    LT1795IFE#PBF 功能描述:IC AMP CURR FEEDBCK DUAL 20TSSOP RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標準包裝:150 系列:- 放大器類型:音頻 電路數(shù):2 輸出類型:- 轉(zhuǎn)換速率:5 V/µs 增益帶寬積:12MHz -3db帶寬:- 電流 - 輸入偏壓:100nA 電壓 - 輸入偏移:500µV 電流 - 電源:6mA 電流 - 輸出 / 通道:50mA 電壓 - 電源,單路/雙路(±):4 V ~ 32 V,±2 V ~ 16 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP(0.173",4.40mm 寬) 供應商設(shè)備封裝:8-TSSOP 包裝:管件
    LT1795IFE#TR 功能描述:IC AMP CURR FEEDBCK DUAL 20TSSOP RoHS:否 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標準包裝:150 系列:- 放大器類型:音頻 電路數(shù):2 輸出類型:- 轉(zhuǎn)換速率:5 V/µs 增益帶寬積:12MHz -3db帶寬:- 電流 - 輸入偏壓:100nA 電壓 - 輸入偏移:500µV 電流 - 電源:6mA 電流 - 輸出 / 通道:50mA 電壓 - 電源,單路/雙路(±):4 V ~ 32 V,±2 V ~ 16 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP(0.173",4.40mm 寬) 供應商設(shè)備封裝:8-TSSOP 包裝:管件
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