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| 型號： | LT1794IFE#TR |
| 廠商： | Linear Technology |
| 文件頁數(shù)： | 4/20頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC OPAMP 200MHZ DUAL 20-TSSOP |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 類型： | 線路驅(qū)動器，發(fā)射器 |
| 驅(qū)動器/接收器數(shù)： | 2/0 |
| 規(guī)程： | xDSL |
| 電源電壓： | 18V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 20-TSSOP（0.173"，4.40mm 寬）裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 20-TSSOP-EP |
| 包裝： | 帶卷 (TR) |
| 其它名稱： | LT1794IFETR |
12
LT1794
EXAMPLE A
θJA = 40°C/W
13MIL VIAS USED: 30
EXAMPLE B
θJA = 47°C/W
13MIL VIAS USED: 35
EXAMPLE C
θJA = 51°C/W
13MIL VIAS USED: 32
EXAMPLE D
θJA = 60°C/W
13MIL VIAS USED: 22
TOPOLOGY
TOP LAYER
2nd LAYER
3rd LAYER
BOTTOM LAYER
VIA PATTERN
1794 F08
SCALE:
1 INCH
APPLICATIO S I FOR ATIO
WU
UU
Figure 8. Examples of PCB Metal Used for Heat Dissipation. LT1794IFE Driver Mounted on Top Layer.
Heat Sink Pad Soldered to Top Layer Metal. External Components Mounted on Bottom Layer
Figure 8 shows four examples of PCB metal being used for
heat spreading. These are provided as a reference for what
might be expected when using different combinations of
metal area on different layers of a PCB. These examples are
with a 4-layer board using 1oz copper on each. The most
effective layers for spreading heat are those closest to the
LT1794 junction. The LT1794IFE is used because the
small TSSOP package is most effective for very compact
line driver designs. This package also has an exposed
metal heat sinking pad on the bottom side which, when
soldered to the PCB top layer metal, directly conducts heat
away from the IC junction. Soldering the thermal pad to the
board produces a thermal resistance from junction to
case,
θJC, of approximately 3°C/W.
Example A utilizes the most total metal area and provides
the lowest thermal resistance. Example B however uses
less metal on the top and bottom layers and still achieves
reasonable thermal performance. For the most compact
board design, inner layer metal can be used for heat
dissipation. This is shown in examples C and D where
minimum metal is used on the top and none on the bottom
layers, only the 2nd and 3rd layers have a heat-conducting
plane. Example C, with the larger metal areas performs
better.
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| LT1794ISW | 功能描述:IC OPAMP 200MHZ DUAL 20-SOIC RoHS:否 類別:集成電路 (IC) >> 接口 - 驅(qū)動器，接收器，收發(fā)器 系列:- 標(biāo)準(zhǔn)包裝:27 系列:- 類型:收發(fā)器 驅(qū)動器/接收器數(shù):3/3 規(guī)程:RS232，RS485 電源電壓:4.75 V ~ 5.25 V 安裝類型:表面貼裝 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:28-SOIC 包裝:管件 |
| LT1794ISW#PBF | 功能描述:IC OPAMP 200MHZ DUAL 20-SOIC RoHS:是 類別:集成電路 (IC) >> 接口 - 驅(qū)動器，接收器，收發(fā)器 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 類型:線路收發(fā)器 驅(qū)動器/接收器數(shù):5/3 規(guī)程:RS232 電源電壓:3 V ~ 5.5 V 安裝類型:表面貼裝 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:28-SOIC 包裝:Digi-Reel® 產(chǎn)品目錄頁面:918 (CN2011-ZH PDF) 其它名稱:296-25096-6 |
| LT1794ISW#TR | 功能描述:IC OPAMP 200MHZ DUAL 20-SOIC RoHS:否 類別:集成電路 (IC) >> 接口 - 驅(qū)動器，接收器，收發(fā)器 系列:- 標(biāo)準(zhǔn)包裝:27 系列:- 類型:收發(fā)器 驅(qū)動器/接收器數(shù):3/3 規(guī)程:RS232，RS485 電源電壓:4.75 V ~ 5.25 V 安裝類型:表面貼裝 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:28-SOIC 包裝:管件 |
| LT1794ISW#TRPBF | 功能描述:IC OPAMP 200MHZ DUAL 20-SOIC RoHS:是 類別:集成電路 (IC) >> 接口 - 驅(qū)動器，接收器，收發(fā)器 系列:- 標(biāo)準(zhǔn)包裝:27 系列:- 類型:收發(fā)器 驅(qū)動器/接收器數(shù):3/3 規(guī)程:RS232，RS485 電源電壓:4.75 V ~ 5.25 V 安裝類型:表面貼裝 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:28-SOIC 包裝:管件 |
| LT1795 | 制造商:LINER 制造商全稱:Linear Technology 功能描述:Dual 500mA/50MHz Current Feedback Line Driver Amplifier |
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