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參數(shù)資料
| 型號(hào)： | LT1784IS6#TRMPBF |
| 廠商： | Linear Technology |
| 文件頁(yè)數(shù)： | 3/12頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC OPAMP R-R IN/OUT SOT23-6 |
| 標(biāo)準(zhǔn)包裝： | 500 |
| 系列： | Over-The-Top® |
| 放大器類型： | 通用 |
| 電路數(shù)： | 1 |
| 輸出類型： | 滿擺幅 |
| 轉(zhuǎn)換速率： | 2.2 V/µs |
| 增益帶寬積： | 2.6MHz |
| 電流 - 輸入偏壓： | 250nA |
| 電壓 - 輸入偏移： | 1600µV |
| 電流 - 電源： | 750µA |
| 電流 - 輸出 / 通道： | 27mA |
| 電壓 - 電源，單路/雙路(±)： | 2.5 V ~ 18 V，±1.25 V ~ 9 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | SOT-23-6 |
| 供應(yīng)商設(shè)備封裝： | TSOT-23-6 |
| 包裝： | 帶卷 (TR) |
| 其它名稱： | LT1784IS6#PBF LT1784IS6#PBF-ND |
LT1784
11
1784fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
S5 Package
5-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1635 Rev B)
1.50 – 1.75
(NOTE 4)
2.80 BSC
0.30 – 0.45 TYP
5 PLCS (NOTE 3)
DATUM ‘A’
0.09 – 0.20
(NOTE 3)
S5 TSOT-23 0302 REV B
PIN ONE
2.90 BSC
(NOTE 4)
0.95 BSC
1.90 BSC
0.80 – 0.90
1.00 MAX
0.01 – 0.10
0.20 BSC
0.30 – 0.50 REF
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
3.85 MAX
0.62
MAX
0.95
REF
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
1.4 MIN
2.62 REF
1.22 REF
S6 Package
6-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1636 Rev B)
1.50 – 1.75
(NOTE 4)
2.80 BSC
0.30 – 0.45
6 PLCS (NOTE 3)
DATUM ‘A’
0.09 – 0.20
(NOTE 3)
S6 TSOT-23 0302 REV B
2.90 BSC
(NOTE 4)
0.95 BSC
1.90 BSC
0.80 – 0.90
1.00 MAX
0.01 – 0.10
0.20 BSC
0.30 – 0.50 REF
PIN ONE ID
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
3.85 MAX
0.62
MAX
0.95
REF
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
1.4 MIN
2.62 REF
1.22 REF
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