參數(shù)資料
型號: LT1207CS
廠商: LINEAR TECHNOLOGY CORP
元件分類: 運動控制電子
英文描述: Dual 250mA/60MHz Current Feedback Amplifier
中文描述: DUAL OP-AMP, 15000 uV OFFSET-MAX, 60 MHz BAND WIDTH, PDSO16
封裝: 0.150 INCH, PLASTIC, SOP-16
文件頁數(shù): 12/16頁
文件大?。?/td> 364K
代理商: LT1207CS
12
LT1207
resistance between the layer is small. Copper board stiff-
eners and plated through holes can also be used to spread
the heat generated by the device.
Table 1 lists thermal resistance for several different board
sizes and copper areas. All measurements were taken in
still air on 3/32" FR-4 board with 2oz copper. This data can
be used as a rough guideline in estimating thermal resis-
tance. The thermal resistance for each application will be
affected by thermal interactions with other components as
well as board size and shape.
Table 1. Fused 16-Lead SO Package
COPPER AREA (2oz)
TOTAL
THERMAL RESISTANCE
TOPSIDE
2500 sq. mm
1000 sq. mm
600 sq. mm
180 sq. mm
180 sq. mm
180 sq. mm
180 sq. mm
180 sq. mm
180 sq. mm
BACKSIDE
2500 sq. mm
2500 sq. mm
2500 sq. mm
2500 sq. mm
1000 sq. mm
600 sq. mm
300 sq. mm
100 sq. mm
0 sq. mm
COPPER AREA (JUNCTION-TO-AMBIENT)
5000 sq. mm
3500 sq. mm
3100 sq. mm
2680 sq. mm
1180 sq. mm
780 sq. mm
480 sq. mm
280 sq. mm
180 sq. mm
40
°
C/W
46
°
C/W
48
°
C/W
49
°
C/W
56
°
C/W
58
°
C/W
59
°
C/W
60
°
C/W
61
°
C/W
where:
T
J
= Junction Temperature
T
A
= Ambient Temperature
P
D
= Device Dissipation
θ
JA
= Thermal Resistance (Junction-to-Ambient)
As an example, calculate the junction temperature for the
circuit in Figure 8 assuming a 70
°
C ambient temperature.
The device dissipation can be found by measuring the
supply currents, calculating the total dissipation and then
subtracting the dissipation in the load and feedback
network.
U
S
A
O
PPLICATI
U
U
The dissipation for each amplifier is:
P
D
= (37.5mA)(30V) – (12V)
2
/(1k||1k) = 0.837W
The total dissipation is P
D
= 1.674W. When a 2500 sq mm
PC board with 2oz copper on top and bottom is used, the
thermal resistance is 40
°
C/W. The junction temperature T
J
is:
T
J
= (1.674W)(40
°
C/W) + 70
°
C = 137
°
C
The maximum junction temperature for the LT1207 is
150
°
C, so the heat sinking capability of the board is
adequate for the application.
If the copper area on the PC board is reduced to 280mm
2
the thermal resistance increases to 60
°
C/W and the junc-
tion temperature becomes:
T
J
= (1.674W)(60
°
C/W) + 70
°
C = 170
°
C
Which is above the maximum junction temperature indi-
cating that the heat sinking capability of the board is
inadequate and should be increased.
COPPER AREA (mm
2
)
0
T
°
C
70
60
50
40
30
20
10
0
LT1207 F07
2000
5000
1000
3000
4000
Figure 7. Thermal Resistance vs Total Copper Area
(Top + Bottom)
Calculating Junction Temperature
The junction temperature can be calculated from the
equation:
T
J
= (P
D
)(
θ
JA
) + T
A
+
1/2 LT1207
SHDN
15V
–15V
0.01
μ
F
1k
330
1k
200pF
–12V
12V
f = 2MHz
37.5mA
I
LT1206 F07
Figure 8. Thermal Calculation Example
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